Reliability and failure of electronic materials and devices:
"Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus...
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| Main Author: | |
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| Other Authors: | |
| Format: | eBook |
| Language: | English |
| Published: |
Amsterdam Boston
Academic Press is an imprint of Elsevier
2014
|
| Edition: | Second edition. |
| Links: | https://app.knovel.com/hotlink/toc/id:kpRFEMDE06/reliability-and-failure?kpromoter=marc |
| Summary: | "Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices"-- Provided by publisher |
| Item Description: | Includes index. Machine generated contents note: CH 1 An Overview of Electronic Devices and Their Reliability CH 2 Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated CH 3 Defects, Contamination and Yield CH 4 The Mathematics of Failure and Reliability CH 5 Mass Transport-Induced Failure Ch 6 Electronic Charge-Induced Damage CH 7 Environmental Damage to Electronic Products CH 8 Packaging Materials, Processes, and Stresses CH 9 Degradation of Contacts and Packages CH 10 Degradation and Failure of Electro-Optical and Magnetic Materials and Devices CH 11 Characterization and Failure Analysis of Material, Devices and Packages CH 12 Future Directions and Reliability Issues. |
| Physical Description: | 1 Online-Ressource |
| ISBN: | 0080575528 9780080575520 |
Staff View
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| 100 | 1 | |a Ohring, Milton |d 1936- | |
| 245 | 1 | 0 | |a Reliability and failure of electronic materials and devices |c Milton Ohring, Lucian Kasprzak |
| 250 | |a Second edition. | ||
| 264 | 1 | |a Amsterdam |a Boston |b Academic Press is an imprint of Elsevier |c 2014 | |
| 300 | |a 1 Online-Ressource | ||
| 336 | |b txt | ||
| 337 | |b c | ||
| 338 | |b cr | ||
| 500 | |a Includes index. | ||
| 500 | |a Machine generated contents note: CH 1 An Overview of Electronic Devices and Their Reliability CH 2 Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated CH 3 Defects, Contamination and Yield CH 4 The Mathematics of Failure and Reliability CH 5 Mass Transport-Induced Failure Ch 6 Electronic Charge-Induced Damage CH 7 Environmental Damage to Electronic Products CH 8 Packaging Materials, Processes, and Stresses CH 9 Degradation of Contacts and Packages CH 10 Degradation and Failure of Electro-Optical and Magnetic Materials and Devices CH 11 Characterization and Failure Analysis of Material, Devices and Packages CH 12 Future Directions and Reliability Issues. | ||
| 520 | |a "Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices"-- Provided by publisher | ||
| 542 | |f Copyright: Elsevier Science & Technology |g 2015 | ||
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| isbn | 0080575528 9780080575520 |
| language | English |
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| publisher | Academic Press is an imprint of Elsevier |
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| spelling | Ohring, Milton 1936- Reliability and failure of electronic materials and devices Milton Ohring, Lucian Kasprzak Second edition. Amsterdam Boston Academic Press is an imprint of Elsevier 2014 1 Online-Ressource txt c cr Includes index. Machine generated contents note: CH 1 An Overview of Electronic Devices and Their Reliability CH 2 Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated CH 3 Defects, Contamination and Yield CH 4 The Mathematics of Failure and Reliability CH 5 Mass Transport-Induced Failure Ch 6 Electronic Charge-Induced Damage CH 7 Environmental Damage to Electronic Products CH 8 Packaging Materials, Processes, and Stresses CH 9 Degradation of Contacts and Packages CH 10 Degradation and Failure of Electro-Optical and Magnetic Materials and Devices CH 11 Characterization and Failure Analysis of Material, Devices and Packages CH 12 Future Directions and Reliability Issues. "Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices"-- Provided by publisher Copyright: Elsevier Science & Technology 2015 Kasprzak, Lucian Erscheint auch als Druck-Ausgabe 9780120885749 |
| spellingShingle | Ohring, Milton 1936- Reliability and failure of electronic materials and devices |
| title | Reliability and failure of electronic materials and devices |
| title_auth | Reliability and failure of electronic materials and devices |
| title_exact_search | Reliability and failure of electronic materials and devices |
| title_full | Reliability and failure of electronic materials and devices Milton Ohring, Lucian Kasprzak |
| title_fullStr | Reliability and failure of electronic materials and devices Milton Ohring, Lucian Kasprzak |
| title_full_unstemmed | Reliability and failure of electronic materials and devices Milton Ohring, Lucian Kasprzak |
| title_short | Reliability and failure of electronic materials and devices |
| title_sort | reliability and failure of electronic materials and devices |
| work_keys_str_mv | AT ohringmilton reliabilityandfailureofelectronicmaterialsanddevices AT kasprzaklucian reliabilityandfailureofelectronicmaterialsanddevices |