Proceedings of the 28th International Cryogenic Engineering Conference and International Cryogenic Materials Conference 2022: ICEC28-ICMC 2022, Hangzhou, China
Gespeichert in:
| Weitere beteiligte Personen: | , , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | Englisch |
| Veröffentlicht: |
Singapore
Springer Nature Singapore
2023
Singapore Springer |
| Ausgabe: | 1st ed. 2023 |
| Schriftenreihe: | Advanced Topics in Science and Technology in China
70 |
| Schlagwörter: | |
| Links: | https://doi.org/10.1007/978-981-99-6128-3 https://doi.org/10.1007/978-981-99-6128-3 https://doi.org/10.1007/978-981-99-6128-3 https://doi.org/10.1007/978-981-99-6128-3 https://doi.org/10.1007/978-981-99-6128-3 |
| Umfang: | 1 Online-Ressource (XLII, 1155 p. 903 illus., 832 illus. in color) |
| ISBN: | 9789819961283 |
| ISSN: | 1995-6827 |
| DOI: | 10.1007/978-981-99-6128-3 |
Internformat
MARC
| LEADER | 00000nam a2200000zcb4500 | ||
|---|---|---|---|
| 001 | BV049396944 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 231107s2023 xx o|||| 00||| eng d | ||
| 020 | |a 9789819961283 |c Online |9 978-981-9961-28-3 | ||
| 024 | 7 | |a 10.1007/978-981-99-6128-3 |2 doi | |
| 035 | |a (ZDB-2-PHA)9789819961283 | ||
| 035 | |a (OCoLC)1409130072 | ||
| 035 | |a (DE-599)BVBBV049396944 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-91 |a DE-19 |a DE-706 |a DE-703 | ||
| 082 | 0 | |a 536.56 |2 23 | |
| 084 | |a PHY 000 |2 stub | ||
| 245 | 1 | 0 | |a Proceedings of the 28th International Cryogenic Engineering Conference and International Cryogenic Materials Conference 2022 |b ICEC28-ICMC 2022, Hangzhou, China |c edited by Limin Qiu, Kai Wang, Yanwei Ma |
| 250 | |a 1st ed. 2023 | ||
| 264 | 1 | |a Singapore |b Springer Nature Singapore |c 2023 | |
| 264 | 1 | |a Singapore |b Springer | |
| 300 | |a 1 Online-Ressource (XLII, 1155 p. 903 illus., 832 illus. in color) | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 490 | 0 | |a Advanced Topics in Science and Technology in China |v 70 |x 1995-6827 | |
| 650 | 4 | |a Low Temperature Physics | |
| 650 | 4 | |a Electronics and Microelectronics, Instrumentation | |
| 650 | 4 | |a Superconductivity | |
| 650 | 4 | |a Ceramics | |
| 650 | 4 | |a Materials Engineering | |
| 650 | 4 | |a Low temperatures | |
| 650 | 4 | |a Electronics | |
| 650 | 4 | |a Superconductivity | |
| 650 | 4 | |a Superconductors | |
| 650 | 4 | |a Ceramic materials | |
| 650 | 4 | |a Materials | |
| 700 | 1 | |a Qiu, Limin |4 edt | |
| 700 | 1 | |a Wang, Kai |4 edt | |
| 700 | 1 | |a Ma, Yanwei |4 edt | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 978-981-9961-27-6 |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 978-981-9961-29-0 |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 978-981-9961-30-6 |
| 856 | 4 | 0 | |u https://doi.org/10.1007/978-981-99-6128-3 |x Verlag |z URL des Erstveröffentlichers |3 Volltext |
| 912 | |a ZDB-2-PHA | ||
| 940 | 1 | |q ZDB-2-PHA_2023 | |
| 943 | 1 | |a oai:aleph.bib-bvb.de:BVB01-034724243 | |
| 966 | e | |u https://doi.org/10.1007/978-981-99-6128-3 |l DE-91 |p ZDB-2-PHA |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-981-99-6128-3 |l DE-19 |p ZDB-2-PHA |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-981-99-6128-3 |l DE-703 |p ZDB-2-PHA |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-981-99-6128-3 |l DE-706 |p ZDB-2-PHA |x Verlag |3 Volltext | |
Datensatz im Suchindex
| DE-BY-TUM_katkey | 2766439 |
|---|---|
| _version_ | 1821936714773430272 |
| any_adam_object | |
| author2 | Qiu, Limin Wang, Kai Ma, Yanwei |
| author2_role | edt edt edt |
| author2_variant | l q lq k w kw y m ym |
| author_facet | Qiu, Limin Wang, Kai Ma, Yanwei |
| building | Verbundindex |
| bvnumber | BV049396944 |
| classification_tum | PHY 000 |
| collection | ZDB-2-PHA |
| ctrlnum | (ZDB-2-PHA)9789819961283 (OCoLC)1409130072 (DE-599)BVBBV049396944 |
| dewey-full | 536.56 |
| dewey-hundreds | 500 - Natural sciences and mathematics |
| dewey-ones | 536 - Heat |
| dewey-raw | 536.56 |
| dewey-search | 536.56 |
| dewey-sort | 3536.56 |
| dewey-tens | 530 - Physics |
| discipline | Physik |
| doi_str_mv | 10.1007/978-981-99-6128-3 |
| edition | 1st ed. 2023 |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02436nam a2200613zcb4500</leader><controlfield tag="001">BV049396944</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">231107s2023 xx o|||| 00||| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9789819961283</subfield><subfield code="c">Online</subfield><subfield code="9">978-981-9961-28-3</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/978-981-99-6128-3</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-2-PHA)9789819961283</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1409130072</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV049396944</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-91</subfield><subfield code="a">DE-19</subfield><subfield code="a">DE-706</subfield><subfield code="a">DE-703</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">536.56</subfield><subfield code="2">23</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">PHY 000</subfield><subfield code="2">stub</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Proceedings of the 28th International Cryogenic Engineering Conference and International Cryogenic Materials Conference 2022</subfield><subfield code="b">ICEC28-ICMC 2022, Hangzhou, China</subfield><subfield code="c">edited by Limin Qiu, Kai Wang, Yanwei Ma</subfield></datafield><datafield tag="250" ind1=" " ind2=" "><subfield code="a">1st ed. 2023</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Singapore</subfield><subfield code="b">Springer Nature Singapore</subfield><subfield code="c">2023</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Singapore</subfield><subfield code="b">Springer</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (XLII, 1155 p. 903 illus., 832 illus. in color)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Advanced Topics in Science and Technology in China</subfield><subfield code="v">70</subfield><subfield code="x">1995-6827</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Low Temperature Physics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics and Microelectronics, Instrumentation</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Superconductivity</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Ceramics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Materials Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Low temperatures</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Superconductivity</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Superconductors</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Ceramic materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Materials</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Qiu, Limin</subfield><subfield code="4">edt</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Wang, Kai</subfield><subfield code="4">edt</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Ma, Yanwei</subfield><subfield code="4">edt</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">978-981-9961-27-6</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">978-981-9961-29-0</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">978-981-9961-30-6</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1007/978-981-99-6128-3</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-2-PHA</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">ZDB-2-PHA_2023</subfield></datafield><datafield tag="943" ind1="1" ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-034724243</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-99-6128-3</subfield><subfield code="l">DE-91</subfield><subfield code="p">ZDB-2-PHA</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-99-6128-3</subfield><subfield code="l">DE-19</subfield><subfield code="p">ZDB-2-PHA</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-99-6128-3</subfield><subfield code="l">DE-703</subfield><subfield code="p">ZDB-2-PHA</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-99-6128-3</subfield><subfield code="l">DE-706</subfield><subfield code="p">ZDB-2-PHA</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| id | DE-604.BV049396944 |
| illustrated | Not Illustrated |
| indexdate | 2024-12-20T20:10:56Z |
| institution | BVB |
| isbn | 9789819961283 |
| issn | 1995-6827 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-034724243 |
| oclc_num | 1409130072 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM DE-19 DE-BY-UBM DE-706 DE-703 |
| owner_facet | DE-91 DE-BY-TUM DE-19 DE-BY-UBM DE-706 DE-703 |
| physical | 1 Online-Ressource (XLII, 1155 p. 903 illus., 832 illus. in color) |
| psigel | ZDB-2-PHA ZDB-2-PHA_2023 |
| publishDate | 2023 |
| publishDateSearch | 2023 |
| publishDateSort | 2023 |
| publisher | Springer Nature Singapore Springer |
| record_format | marc |
| series2 | Advanced Topics in Science and Technology in China |
| spellingShingle | Proceedings of the 28th International Cryogenic Engineering Conference and International Cryogenic Materials Conference 2022 ICEC28-ICMC 2022, Hangzhou, China Low Temperature Physics Electronics and Microelectronics, Instrumentation Superconductivity Ceramics Materials Engineering Low temperatures Electronics Superconductors Ceramic materials Materials |
| title | Proceedings of the 28th International Cryogenic Engineering Conference and International Cryogenic Materials Conference 2022 ICEC28-ICMC 2022, Hangzhou, China |
| title_auth | Proceedings of the 28th International Cryogenic Engineering Conference and International Cryogenic Materials Conference 2022 ICEC28-ICMC 2022, Hangzhou, China |
| title_exact_search | Proceedings of the 28th International Cryogenic Engineering Conference and International Cryogenic Materials Conference 2022 ICEC28-ICMC 2022, Hangzhou, China |
| title_full | Proceedings of the 28th International Cryogenic Engineering Conference and International Cryogenic Materials Conference 2022 ICEC28-ICMC 2022, Hangzhou, China edited by Limin Qiu, Kai Wang, Yanwei Ma |
| title_fullStr | Proceedings of the 28th International Cryogenic Engineering Conference and International Cryogenic Materials Conference 2022 ICEC28-ICMC 2022, Hangzhou, China edited by Limin Qiu, Kai Wang, Yanwei Ma |
| title_full_unstemmed | Proceedings of the 28th International Cryogenic Engineering Conference and International Cryogenic Materials Conference 2022 ICEC28-ICMC 2022, Hangzhou, China edited by Limin Qiu, Kai Wang, Yanwei Ma |
| title_short | Proceedings of the 28th International Cryogenic Engineering Conference and International Cryogenic Materials Conference 2022 |
| title_sort | proceedings of the 28th international cryogenic engineering conference and international cryogenic materials conference 2022 icec28 icmc 2022 hangzhou china |
| title_sub | ICEC28-ICMC 2022, Hangzhou, China |
| topic | Low Temperature Physics Electronics and Microelectronics, Instrumentation Superconductivity Ceramics Materials Engineering Low temperatures Electronics Superconductors Ceramic materials Materials |
| topic_facet | Low Temperature Physics Electronics and Microelectronics, Instrumentation Superconductivity Ceramics Materials Engineering Low temperatures Electronics Superconductors Ceramic materials Materials |
| url | https://doi.org/10.1007/978-981-99-6128-3 |
| work_keys_str_mv | AT qiulimin proceedingsofthe28thinternationalcryogenicengineeringconferenceandinternationalcryogenicmaterialsconference2022icec28icmc2022hangzhouchina AT wangkai proceedingsofthe28thinternationalcryogenicengineeringconferenceandinternationalcryogenicmaterialsconference2022icec28icmc2022hangzhouchina AT mayanwei proceedingsofthe28thinternationalcryogenicengineeringconferenceandinternationalcryogenicmaterialsconference2022icec28icmc2022hangzhouchina |