Verfügbarkeit: 3D Interconnect Architectures for Heterogeneous Technologies

3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization

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Bibliographische Detailangaben
Beteiligte Personen:	Bamberg, Lennart (VerfasserIn), Joseph, Jan Moritz (VerfasserIn), García-Ortiz, Alberto (VerfasserIn), Pionteck, Thilo (VerfasserIn)
Format:	Elektronisch E-Book
Sprache:	Englisch
Veröffentlicht:	Cham Springer International Publishing 2022 Cham Springer
Ausgabe:	1st ed. 2022
Schlagwörter:	Electronic Circuits and Systems Embedded Systems Processor Architectures Electronic circuits Embedded computer systems Microprocessors Computer architecture
Links:	https://doi.org/10.1007/978-3-030-98229-4 https://doi.org/10.1007/978-3-030-98229-4 https://doi.org/10.1007/978-3-030-98229-4 https://doi.org/10.1007/978-3-030-98229-4 https://doi.org/10.1007/978-3-030-98229-4 https://doi.org/10.1007/978-3-030-98229-4 https://doi.org/10.1007/978-3-030-98229-4 https://doi.org/10.1007/978-3-030-98229-4 https://doi.org/10.1007/978-3-030-98229-4 https://doi.org/10.1007/978-3-030-98229-4 https://doi.org/10.1007/978-3-030-98229-4 https://doi.org/10.1007/978-3-030-98229-4 https://doi.org/10.1007/978-3-030-98229-4 https://doi.org/10.1007/978-3-030-98229-4 https://doi.org/10.1007/978-3-030-98229-4 https://doi.org/10.1007/978-3-030-98229-4 https://doi.org/10.1007/978-3-030-98229-4 https://doi.org/10.1007/978-3-030-98229-4 https://doi.org/10.1007/978-3-030-98229-4
Umfang:	1 Online-Ressource (XXV, 395 p. 102 illus., 100 illus. in color)
ISBN:	9783030982294
DOI:	10.1007/978-3-030-98229-4

Internformat

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Datensatz im Suchindex

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spellingShingle	Bamberg, Lennart Joseph, Jan Moritz García-Ortiz, Alberto Pionteck, Thilo 3D Interconnect Architectures for Heterogeneous Technologies Modeling and Optimization Electronic Circuits and Systems Embedded Systems Processor Architectures Electronic circuits Embedded computer systems Microprocessors Computer architecture
title	3D Interconnect Architectures for Heterogeneous Technologies Modeling and Optimization
title_auth	3D Interconnect Architectures for Heterogeneous Technologies Modeling and Optimization
title_exact_search	3D Interconnect Architectures for Heterogeneous Technologies Modeling and Optimization
title_full	3D Interconnect Architectures for Heterogeneous Technologies Modeling and Optimization by Lennart Bamberg, Jan Moritz Joseph, Alberto García-Ortiz, Thilo Pionteck
title_fullStr	3D Interconnect Architectures for Heterogeneous Technologies Modeling and Optimization by Lennart Bamberg, Jan Moritz Joseph, Alberto García-Ortiz, Thilo Pionteck
title_full_unstemmed	3D Interconnect Architectures for Heterogeneous Technologies Modeling and Optimization by Lennart Bamberg, Jan Moritz Joseph, Alberto García-Ortiz, Thilo Pionteck
title_short	3D Interconnect Architectures for Heterogeneous Technologies
title_sort	3d interconnect architectures for heterogeneous technologies modeling and optimization
title_sub	Modeling and Optimization
topic	Electronic Circuits and Systems Embedded Systems Processor Architectures Electronic circuits Embedded computer systems Microprocessors Computer architecture
topic_facet	Electronic Circuits and Systems Embedded Systems Processor Architectures Electronic circuits Embedded computer systems Microprocessors Computer architecture
url	https://doi.org/10.1007/978-3-030-98229-4
work_keys_str_mv	AT bamberglennart 3dinterconnectarchitecturesforheterogeneoustechnologiesmodelingandoptimization AT josephjanmoritz 3dinterconnectarchitecturesforheterogeneoustechnologiesmodelingandoptimization AT garciaortizalberto 3dinterconnectarchitecturesforheterogeneoustechnologiesmodelingandoptimization AT pionteckthilo 3dinterconnectarchitecturesforheterogeneoustechnologiesmodelingandoptimization

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