Introduction to microsystem packaging technology:
Gespeichert in:
| Beteiligte Personen: | , , |
|---|---|
| Format: | Buch |
| Sprache: | Englisch |
| Veröffentlicht: |
Boca Raton, FL
CRC Press/Taylor & Francis
[2011]
|
| Schlagwörter: | |
| Beschreibung: | Includes bibliographical references and index |
| Umfang: | xiii, 218 pages Illustrationen, Diagramme 27 cm |
| ISBN: | 9781439819104 1439819106 |
Internformat
MARC
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| 100 | 1 | |a Jin, Yufeng |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Introduction to microsystem packaging technology |c Yufeng Jin, Zhiping Wang, Jing Chen |
| 264 | 1 | |a Boca Raton, FL |b CRC Press/Taylor & Francis |c [2011] | |
| 300 | |a xiii, 218 pages |b Illustrationen, Diagramme |c 27 cm | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 500 | |a Includes bibliographical references and index | ||
| 650 | 4 | |a Microelectronic packaging | |
| 650 | 0 | 7 | |a Mikrosystemtechnik |0 (DE-588)4221617-5 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Mikrosystemtechnik |0 (DE-588)4221617-5 |D s |
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| 700 | 1 | |a Wang, Zhiping |e Verfasser |0 (DE-588)130309737 |4 aut | |
| 700 | 1 | |a Chen, Jing |e Verfasser |0 (DE-588)1014973872 |4 aut | |
| 943 | 1 | |a oai:aleph.bib-bvb.de:BVB01-030690208 | |
Datensatz im Suchindex
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| author | Jin, Yufeng Wang, Zhiping Chen, Jing |
| author_GND | (DE-588)130309737 (DE-588)1014973872 |
| author_facet | Jin, Yufeng Wang, Zhiping Chen, Jing |
| author_role | aut aut aut |
| author_sort | Jin, Yufeng |
| author_variant | y j yj z w zw j c jc |
| building | Verbundindex |
| bvnumber | BV045303091 |
| callnumber-first | T - Technology |
| callnumber-label | TK7870 |
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| callnumber-search | TK7870.15 |
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| ctrlnum | (OCoLC)699835783 (DE-599)BVBBV045303091 |
| dewey-full | 621.381/046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/046 |
| dewey-search | 621.381/046 |
| dewey-sort | 3621.381 246 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV045303091 |
| illustrated | Illustrated |
| indexdate | 2024-12-20T18:23:29Z |
| institution | BVB |
| isbn | 9781439819104 1439819106 |
| language | English |
| lccn | 009045580 |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030690208 |
| oclc_num | 699835783 |
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| owner | DE-859 DE-1043 |
| owner_facet | DE-859 DE-1043 |
| physical | xiii, 218 pages Illustrationen, Diagramme 27 cm |
| publishDate | 2011 |
| publishDateSearch | 2011 |
| publishDateSort | 2011 |
| publisher | CRC Press/Taylor & Francis |
| record_format | marc |
| spelling | Jin, Yufeng Verfasser aut Introduction to microsystem packaging technology Yufeng Jin, Zhiping Wang, Jing Chen Boca Raton, FL CRC Press/Taylor & Francis [2011] xiii, 218 pages Illustrationen, Diagramme 27 cm txt rdacontent n rdamedia nc rdacarrier Includes bibliographical references and index Microelectronic packaging Mikrosystemtechnik (DE-588)4221617-5 gnd rswk-swf Mikrosystemtechnik (DE-588)4221617-5 s DE-604 Wang, Zhiping Verfasser (DE-588)130309737 aut Chen, Jing Verfasser (DE-588)1014973872 aut |
| spellingShingle | Jin, Yufeng Wang, Zhiping Chen, Jing Introduction to microsystem packaging technology Microelectronic packaging Mikrosystemtechnik (DE-588)4221617-5 gnd |
| subject_GND | (DE-588)4221617-5 |
| title | Introduction to microsystem packaging technology |
| title_auth | Introduction to microsystem packaging technology |
| title_exact_search | Introduction to microsystem packaging technology |
| title_full | Introduction to microsystem packaging technology Yufeng Jin, Zhiping Wang, Jing Chen |
| title_fullStr | Introduction to microsystem packaging technology Yufeng Jin, Zhiping Wang, Jing Chen |
| title_full_unstemmed | Introduction to microsystem packaging technology Yufeng Jin, Zhiping Wang, Jing Chen |
| title_short | Introduction to microsystem packaging technology |
| title_sort | introduction to microsystem packaging technology |
| topic | Microelectronic packaging Mikrosystemtechnik (DE-588)4221617-5 gnd |
| topic_facet | Microelectronic packaging Mikrosystemtechnik |
| work_keys_str_mv | AT jinyufeng introductiontomicrosystempackagingtechnology AT wangzhiping introductiontomicrosystempackagingtechnology AT chenjing introductiontomicrosystempackagingtechnology |