Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development
The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date eng...
Gespeichert in:
| Beteiligte Personen: | , , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | Englisch |
| Veröffentlicht: |
Boston, MA
Springer US
1998
|
| Schlagwörter: | |
| Links: | https://doi.org/10.1007/978-1-4615-5671-8 https://doi.org/10.1007/978-1-4615-5671-8 |
| Zusammenfassung: | The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: • the economic impact of employing the microelectronics fabricated by in dustry, • a study of the relationship between reliability and yield, • the progression toward miniaturization and higher reliability, and • the correctness and complexity of new system designs, which include a very significant portion of software |
| Umfang: | 1 Online-Ressource (XXVI, 394 p) |
| ISBN: | 9781461556718 |
| DOI: | 10.1007/978-1-4615-5671-8 |
Internformat
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| author | Kuo, Way Chien, Wei-Ting Kary Kim, Taeho |
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| discipline | Werkstoffwissenschaften / Fertigungstechnik |
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| isbn | 9781461556718 |
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| spelling | Kuo, Way Verfasser aut Reliability, Yield, and Stress Burn-In A Unified Approach for Microelectronics Systems Manufacturing & Software Development by Way Kuo, Wei-Ting Kary Chien, Taeho Kim Boston, MA Springer US 1998 1 Online-Ressource (XXVI, 394 p) txt rdacontent c rdamedia cr rdacarrier The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: • the economic impact of employing the microelectronics fabricated by in dustry, • a study of the relationship between reliability and yield, • the progression toward miniaturization and higher reliability, and • the correctness and complexity of new system designs, which include a very significant portion of software Engineering Manufacturing, Machines, Tools Electrical Engineering Optical and Electronic Materials Manufacturing industries Machines Tools Electrical engineering Optical materials Electronic materials Zuverlässigkeit (DE-588)4059245-5 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 s Zuverlässigkeit (DE-588)4059245-5 s 1\p DE-604 Chien, Wei-Ting Kary aut Kim, Taeho aut Erscheint auch als Druck-Ausgabe 9780792381075 https://doi.org/10.1007/978-1-4615-5671-8 Verlag URL des Erstveröffentlichers Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Kuo, Way Chien, Wei-Ting Kary Kim, Taeho Reliability, Yield, and Stress Burn-In A Unified Approach for Microelectronics Systems Manufacturing & Software Development Engineering Manufacturing, Machines, Tools Electrical Engineering Optical and Electronic Materials Manufacturing industries Machines Tools Electrical engineering Optical materials Electronic materials Zuverlässigkeit (DE-588)4059245-5 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd |
| subject_GND | (DE-588)4059245-5 (DE-588)4014360-0 |
| title | Reliability, Yield, and Stress Burn-In A Unified Approach for Microelectronics Systems Manufacturing & Software Development |
| title_auth | Reliability, Yield, and Stress Burn-In A Unified Approach for Microelectronics Systems Manufacturing & Software Development |
| title_exact_search | Reliability, Yield, and Stress Burn-In A Unified Approach for Microelectronics Systems Manufacturing & Software Development |
| title_full | Reliability, Yield, and Stress Burn-In A Unified Approach for Microelectronics Systems Manufacturing & Software Development by Way Kuo, Wei-Ting Kary Chien, Taeho Kim |
| title_fullStr | Reliability, Yield, and Stress Burn-In A Unified Approach for Microelectronics Systems Manufacturing & Software Development by Way Kuo, Wei-Ting Kary Chien, Taeho Kim |
| title_full_unstemmed | Reliability, Yield, and Stress Burn-In A Unified Approach for Microelectronics Systems Manufacturing & Software Development by Way Kuo, Wei-Ting Kary Chien, Taeho Kim |
| title_short | Reliability, Yield, and Stress Burn-In |
| title_sort | reliability yield and stress burn in a unified approach for microelectronics systems manufacturing software development |
| title_sub | A Unified Approach for Microelectronics Systems Manufacturing & Software Development |
| topic | Engineering Manufacturing, Machines, Tools Electrical Engineering Optical and Electronic Materials Manufacturing industries Machines Tools Electrical engineering Optical materials Electronic materials Zuverlässigkeit (DE-588)4059245-5 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd |
| topic_facet | Engineering Manufacturing, Machines, Tools Electrical Engineering Optical and Electronic Materials Manufacturing industries Machines Tools Electrical engineering Optical materials Electronic materials Zuverlässigkeit Elektronisches Bauelement |
| url | https://doi.org/10.1007/978-1-4615-5671-8 |
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