Thin film materials: stress, defect formation, and surface evolution

Thin film mechanical behavior and stress presents a technological challenge for materials scientists, physicists and engineers. This book provides a comprehensive coverage of the major issues and topics dealing with stress, defect formation, surface evolution and allied effects in thin film material...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Beteilige Person: Freund, L. B. (VerfasserIn)
Format: Elektronisch E-Book
Sprache:Englisch
Veröffentlicht: Cambridge Cambridge University Press 2003
Schlagwörter:
Links:https://doi.org/10.1017/CBO9780511754715
https://doi.org/10.1017/CBO9780511754715
https://doi.org/10.1017/CBO9780511754715
Zusammenfassung:Thin film mechanical behavior and stress presents a technological challenge for materials scientists, physicists and engineers. This book provides a comprehensive coverage of the major issues and topics dealing with stress, defect formation, surface evolution and allied effects in thin film materials. Physical phenomena are examined from the continuum down to the sub-microscopic length scales, with the connections between the structure of the material and its behavior described. Theoretical concepts are underpinned by discussions on experimental methodology and observations. Fundamental scientific concepts are embedded through sample calculations, a broad range of case studies with practical applications, thorough referencing, and end of chapter problems. With solutions to problems available on-line, this book will be essential for graduate courses on thin films and the classic reference for researchers in the field
Beschreibung:Title from publisher's bibliographic system (viewed on 05 Oct 2015)
Umfang:1 online resource (xviii, 750 pages)
ISBN:9780511754715
DOI:10.1017/CBO9780511754715