Verfügbarkeit: Three-dimensional molded interconnect devices (3D-MID)

Three-dimensional molded interconnect devices (3D-MID): materials, manufacturing, assembly and applications for injection molded circuit carriers

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Bibliographische Detailangaben
Beteilige Person:	Franke, Jörg 1964- (VerfasserIn)
Format:	Elektronisch E-Book
Sprache:	Englisch
Veröffentlicht:	München Hanser 2014
Schlagwörter:	Dreidimensionaler spritzgegossener Schaltungsträger
Links:	https://doi.org/10.3139/9781569905524?locatt=mode:legacy https://doi.org/10.3139/9781569905524?locatt=mode:legacy https://doi.org/10.3139/9781569905524?locatt=mode:legacy https://doi.org/10.3139/9781569905524?locatt=mode:legacy https://doi.org/10.3139/9781569905524?locatt=mode:legacy https://doi.org/10.3139/9781569905524?locatt=mode:legacy https://doi.org/10.3139/9781569905524?locatt=mode:legacy https://doi.org/10.3139/9781569905524?locatt=mode:legacy https://doi.org/10.3139/9781569905524?locatt=mode:legacy https://doi.org/10.3139/9781569905524
Umfang:	1 Online-Ressource (XII, 356 S.) Ill., graph. Darst.
ISBN:	9781569905524
DOI:	10.3139/9781569905524

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Datensatz im Suchindex

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spellingShingle	Franke, Jörg 1964- Three-dimensional molded interconnect devices (3D-MID) materials, manufacturing, assembly and applications for injection molded circuit carriers Dreidimensionaler spritzgegossener Schaltungsträger (DE-588)4550503-2 gnd
subject_GND	(DE-588)4550503-2
title	Three-dimensional molded interconnect devices (3D-MID) materials, manufacturing, assembly and applications for injection molded circuit carriers
title_auth	Three-dimensional molded interconnect devices (3D-MID) materials, manufacturing, assembly and applications for injection molded circuit carriers
title_exact_search	Three-dimensional molded interconnect devices (3D-MID) materials, manufacturing, assembly and applications for injection molded circuit carriers
title_full	Three-dimensional molded interconnect devices (3D-MID) materials, manufacturing, assembly and applications for injection molded circuit carriers Jörg Franke
title_fullStr	Three-dimensional molded interconnect devices (3D-MID) materials, manufacturing, assembly and applications for injection molded circuit carriers Jörg Franke
title_full_unstemmed	Three-dimensional molded interconnect devices (3D-MID) materials, manufacturing, assembly and applications for injection molded circuit carriers Jörg Franke
title_short	Three-dimensional molded interconnect devices (3D-MID)
title_sort	three dimensional molded interconnect devices 3d mid materials manufacturing assembly and applications for injection molded circuit carriers
title_sub	materials, manufacturing, assembly and applications for injection molded circuit carriers
topic	Dreidimensionaler spritzgegossener Schaltungsträger (DE-588)4550503-2 gnd
topic_facet	Dreidimensionaler spritzgegossener Schaltungsträger
url	https://doi.org/10.3139/9781569905524
work_keys_str_mv	AT frankejorg threedimensionalmoldedinterconnectdevices3dmidmaterialsmanufacturingassemblyandapplicationsforinjectionmoldedcircuitcarriers

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