APA (7th ed.) Citation

Schüßler, F., Kozic, D., & Franke, J. (2009). Influences on the reflow soldering process by components with specific thermal properties.

Chicago Style (17th ed.) Citation

Schüßler, Florian, Denis Kozic, and Jörg Franke. Influences on the Reflow Soldering Process by Components with Specific Thermal Properties. 2009.

MLA (9th ed.) Citation

Schüßler, Florian, et al. Influences on the Reflow Soldering Process by Components with Specific Thermal Properties. 2009.