Influences on the reflow soldering process by components with specific thermal properties:
Gespeichert in:
| Beteiligte Personen: | , , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | Englisch |
| Veröffentlicht: |
2009
|
| Links: | https://open.fau.de/handle/openfau/2906 https://nbn-resolving.org/urn:nbn:de:bvb:29-opus-41424 |
| Beschreibung: | Aus: Circuit World ; 35. 2009 |
| Umfang: | 1 Online-Ressource |
Internformat
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Datensatz im Suchindex
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| author | Schüßler, Florian Kozic, Denis Franke, Jörg |
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| indexdate | 2024-12-20T16:23:49Z |
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| spelling | Schüßler, Florian Verfasser aut Influences on the reflow soldering process by components with specific thermal properties Florian Schüßler ; Denis Kozic ; Jörg Franke 2009 1 Online-Ressource txt rdacontent c rdamedia cr rdacarrier Aus: Circuit World ; 35. 2009 Kozic, Denis Verfasser aut Franke, Jörg Verfasser aut https://open.fau.de/handle/openfau/2906 Verlag kostenfrei Volltext https://nbn-resolving.org/urn:nbn:de:bvb:29-opus-41424 Resolving-System kostenfrei Volltext |
| spellingShingle | Schüßler, Florian Kozic, Denis Franke, Jörg Influences on the reflow soldering process by components with specific thermal properties |
| title | Influences on the reflow soldering process by components with specific thermal properties |
| title_auth | Influences on the reflow soldering process by components with specific thermal properties |
| title_exact_search | Influences on the reflow soldering process by components with specific thermal properties |
| title_full | Influences on the reflow soldering process by components with specific thermal properties Florian Schüßler ; Denis Kozic ; Jörg Franke |
| title_fullStr | Influences on the reflow soldering process by components with specific thermal properties Florian Schüßler ; Denis Kozic ; Jörg Franke |
| title_full_unstemmed | Influences on the reflow soldering process by components with specific thermal properties Florian Schüßler ; Denis Kozic ; Jörg Franke |
| title_short | Influences on the reflow soldering process by components with specific thermal properties |
| title_sort | influences on the reflow soldering process by components with specific thermal properties |
| url | https://open.fau.de/handle/openfau/2906 https://nbn-resolving.org/urn:nbn:de:bvb:29-opus-41424 |
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