Experimental mechanics of solids:
Gespeichert in:
| Beteiligte Personen: | , |
|---|---|
| Format: | Buch |
| Sprache: | Englisch |
| Veröffentlicht: |
Chichester
John Wiley
2012
|
| Ausgabe: | 1. publ. |
| Schlagwörter: | |
| Links: | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=024973031&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| Beschreibung: | Includes bibliographical references and index |
| Umfang: | XVI, 743 S. Ill., graph. Darst. |
| ISBN: | 9780470689530 |
Internformat
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| 100 | 1 | |a Sciammarella, Cesar A. |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Experimental mechanics of solids |c Cesar A. Sciammarella ; Fedeerico M. Sciammarella |
| 250 | |a 1. publ. | ||
| 264 | 1 | |a Chichester |b John Wiley |c 2012 | |
| 300 | |a XVI, 743 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 500 | |a Includes bibliographical references and index | ||
| 650 | 4 | |a Strength of materials | |
| 650 | 4 | |a Solids |x Mechanical properties | |
| 650 | 4 | |a Structural analysis (Engineering) | |
| 650 | 0 | 7 | |a Festkörpermechanik |0 (DE-588)4129367-8 |2 gnd |9 rswk-swf |
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| 700 | 1 | |a Sciammarella, Federico M. |e Verfasser |4 aut | |
| 856 | 4 | 2 | |m HBZ Datenaustausch |q application/pdf |u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=024973031&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |3 Inhaltsverzeichnis |
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Datensatz im Suchindex
| _version_ | 1819364440811765760 |
|---|---|
| adam_text | Titel: Experimental mechanics of solids
Autor: Sciammarella, Cesar A
Jahr: 2012
Contents
About the Authors xvii
Preface xix
Foreword xxi
1 Continuum Mechanics - Historical Background 1
1.1 Definition of the Concept of Stress 4
1.2 Transformation of Coordinates 5
1.3 Stress Tensor Representation 6
1.3.1 Two Dimensional Case 1
1.4 Principal Stresses 8
/ .4.1 How to Calculate Principal Stresses after Making the Transformation 9
1.4.2 Maximum and Minimum Shear Stresses 10
1.5 Principal Stresses in Two Dimensions 10
1.6 The Equations of Equilibrium 11
1.7 Strain Tensor 13
1.8 Stress - Strain Relations 15
1.8.1 Homogeneous or Not? 16
1.8.2 Material Coordinate System 16
/ .8.3 Linear, Elastic, Isotropic Materials. Lame Constants 18
1.9 Equations of Compatibility 18
References 19
2 Theoretical Stress Analysis - Basic Formulation of Continuum Mechanics.
Theory of Elasticity 21
2.1 Introduction 21
2.2 Fundamental Assumptions 21
2.3 General Problem 22
2.3.1 Boundary Conditions I i
2.4 St. Venant s Principle 25
2.5 Plane Stress, Plane Strain 28
2.5.1 Solutions of Problems of 2D Using the Airy s Stress Function 29
2.6 Plane Stress Solution of a Simply Supported Beam with a Uniform Load 30
2.7 Solutions in Plane Strain and in Plane Stress 33
2.8 The Plane Problem in Polar Coordinates 35
2.9 Thick Wall Cylinders 36
References 39
Contents
3 Strain Gages - Introduction to Electrical Strain Gages 41
3.1 Strain Measurements - Point Methods 41
3.2 Electrical Strain Gages 42
3.3 Basics of Electrical Strain Gages 43
3.3.1 Backing Material 43
3.3.2 Cements 44
3.3.3 Application of Gages onto Sulfates 45
3.4 Gage Factor 45
3.4.1 Derivation of Gage Factor 45
3.4.2 Alloys for Strain Gages 47
3.4.3 Semiconductor Strain Gages 48
3.5 Basic Characteristics of Electrical Strain Gages 48
3.5.1 Electrical Resistance 48
3.5.2 Temperature Effect 49
3.5.3 Corrections for Thermal Output 51
3.5.4 Adjusting Thermal Output for Gage Factor 53
3.6 Errors Due to the Transverse Sensitivity 54
3.6.1 Corrections Due to the Transversal Sensitivity 55
3.7 Errors Due to Misalignment of Strain Gages 58
3.8 Reinforcing Effect of the Gage 60
3.9 Effect of the Resistance to Ground 61
3.10 Linearity of the Gages. Hysteresis 63
3.11 Maximum Deformations 64
3.12 Stability in Time 64
3.13 Heat Generation and Dissipation 64
3.14 Effect of External Ambient Pressure 65
3.14.1 Additional Consideration Concerning the Effect of Pressure on Strain Gages 66
3.14.2 Additional Environment Effects to Consider 66
3.14.3 Electromagnetic Fields 67
3.15 Dynamic Effects 67
3.15.1 Transient Effects 67
3.15.2 Steady State Response. Fatigue Characteristics of Strain Gauges 69
References 71
4 Strain Gages Instrumentation - The Wheatstone Bridge 75
4.1 Introduction 75
4.1.1 Derivation of the Wheatstone Equilibrium Condition 76
4.1.2 Full Bridge Arrangements in Some Simple Cases of Loadings 82
4.1.3 Linearity Errors of the Wheatstone Bridge with Constant Voltage 83
4.1.4 Temperature Compensation in the Bridge Circuit 87
4.1.5 Leadwire Resistance/Temperature Compensation 90
4.1.6 Shunt Calibration of Strain Gage Instrumentation 94
4.1.7 Series Resistance Null Balance 97
4.1.8 Available Commercial Instrumentation 98
4.1.9 Dynamic Measurements 100
4.1.10 Potentiometer Circuit 103
4.1.11 Operational Amplifiers 105
References 109
Contents
5 Strain Gage Rosettes: Selection, Application and Data Reduction 111
5.1 Introduction 111
5.1.1 Strain Gages Rosettes 112
5.1.2 Data Analysis of the Strain Gage Rosettes 116
5.2 Errors, Corrections, and Limitations for Rosettes 119
5.3 Applications of Gages to Load Cells 119
References 121
6 Optical Methods - Introduction 123
6.1 Historical Perspective and Overview 123
6.1.1 Greek and Hellenistic Theories 123
6.1.2 Middle Eastern Theories 123
6.1.3 WesternTheories(1600s-1800s) 124
6.1.4 Western Theories (1900s-Present) 125
6.2 Fundamental Basic Definitions of Optics 127
6.2.1 Wave-Particle Duality 127
6.3 The Electromagnetic Theory of Light 128
6.3.1 Cartesian Coordinates System Solutions of Maxwell Equations 130
6.4 Properties of Polarized Light 137
6.5 The Jones Vector Representation 138
6.6 Light Intensity 141
6.7 Refraction of the Light 141
6.7.1 Fresnel Equations 143
6.7.2 Total Internal Reflection 145
6.7.3 Evanescent Field 146
6.8 Geometrical Optics. Lenses and Mirrors 146
6.8.1 Lens Aberrations 149
6.8.2 Compound Thin Lenses 152
6.8.3 Curved Mirrors, Basic Relationships 153
References 154
7 Optical Methods - Interference and Diffraction of Light 155
7.1 Connecting Light Interference with Basic Optical Concepts 155
7.2 Light Sources 155
7.2.1 Phase Velocity and Group Velocity 159
7.3 Interference 161
7.3.1 Derivation of the Equations of Interference 162
7.4 Interferometers 166
7.4.1 Wave Front-Splitting Interferometers 166
7.4.2 Michelson Interferometer 168
7.4.3 The Mach-Zehnder Interferometer 168
7.4.4 The Fabry-Perot Interferometer 169
7.4.5 Polariscopes 170
7.4.6 Concept of Phasor 170
7.5 Diffraction of the Light 171
7.5.1 Solutions of the Problem of an Aperture in the Field of Propagation
of Light Wave Fronts 173
7.5.2 Fourier Transforming Property of Lenses 179
References 181
Contents
8 Optical Methods - Fourier Transform 183
8.1 Introduction 183
8.2 Simple Properties 185
8.2.1 Linearity 185
8.2.2 Frequency Shifting 185
8.2.3 Space Shifting 185
8.2.4 Space Differentiation 186
8.2.5 Correlation and Convolution 186
8.2.6 Autocorrelation Function 187
8.2.7 The Parseval s Theorem 187
8.3 Transition to Two Dimensions 187
8.4 Special Functions 188
8.4.1 Dirac Delta 188
8.4.2 Comb Function 189
8.4.3 Rectangle Function 190
8.4.4 The Signum Function 191
8.4.5 Circle Function 191
8.5 Applications to Diffraction Problems 191
8.5.1 Rectangular Aperture 192
8.5.2 Circular Aperture 193
8.6 Diffraction Patterns of Gratings 193
8.7 Angular Spectrum 195
8.8 Utilization of the FT in the Analysis of Diffraction Gratings 199
8.8.1 An Approximated Method to Describe the Diffraction Pattern of Gratings 202
References 205
9 Optical Methods - Computer Vision 207
9.1 Introduction 207
9.2 Study of Lens Systems 208
9.3 Lens System, Coordinate Axis and Basic Layout 210
9.4 Diffraction Effect on Images 211
9.4.1 Examples of Pupils 214
9.5 Analysis of the Derived Pupil Equations for Coherent Illumination 216
9.6 Imaging with Incoherent Illumination 217
9.6.1 Coherent and Non Coherent Illumination. Effect on the Image 221
9.6.2 Criteria for the Selection of Lenses 226
9.6.3 Standard Nomenclatures 227
9.7 Digital Cameras 230
9.7.1 CCDsandCMOSs 230
9.7.2 Monochrome vs. Color Cameras 233
9.7.3 Basic Notions in the Image Acquisition Process 235
9.7.4 Exposure Time of a Sensor. Relationship to the Object Intensity 235
9.7.5 Sensor Size 239
9.8 Illumination Systems 242
9.8.1 Radiometry 242
9.8.2 Interaction of Light with Matter and Directional Properties 244
9.8.3 Illumination Techniques 245
9.9 Imaging Processing Systems 245
9.9.1 Frame Grabbers 246
Contents
9.10 Getting High Quality Images 246
9.10.1 Resolution 246
9.10.2 Perspective Errors 248
References 249
10 Optical Methods - Discrete Fourier Transform 251
10.1 Extension to Two Dimensions 253
10.1.1 Windowing 256
10.2 The Whittaker-Shannon Theorem 257
10.3 General Representation of the Signals Subjected to Analysis 261
10.3.1 Signal Structure 262
10.3.2 Signal Information and Noise Presence in the Signal 265
10.3.3 Linear Filters 267
10.4 Computation of the Phase of the Fringes 271
10.4.1 Computation of the Phase. Signals in Quadrature 272
10.4.2 Phase Stepping Technique 273
10.4.3 Comparison between in-Quadrature and Phase Stepping Techniques
of Phase Retrieval 275
10.4.4 Two Dimensional Phase Unwrapping 275
10.5 Fringe Patterns Singularities 276
10.5.1 Fringe Dislocations 277
10.6 Extension of the Fringes beyond Boundaries 279
References 283
11 Photoelasticity - Introduction 285
11.1 Introduction 285
11.2 Derivation of the Fundamental Equations 286
11.3 Wave Plates 291
11.3.1 Utilization of the Jones Notation to Characterize Wave Plates 292
11.4 Polarizers 293
11.5 Instrument Matrices 294
11.6 Polariscopes 296
11.6.1 Plane Polariscope 297
11.6.2 Circular Polariscope 301
11.7 Artificial Birefringence 304
11.7.1 Constitutive Equations 304
11.8 Polariscopes 307
11.8.1 Lens Polariscopes 307
11.8.2 Diffuse Light Polariscopes 307
11.9 Equations of the Intensities of the Plane Polariscope and the Circular Polariscope
for a Stressed Plate 309
References 311
12 Photoelasticity Applications 313
12.1 Calibration Procedures of a Photoelastic Material 313
12.1.1 Different Notations and Meaning for the Photoelastic Constant 317
12.2 Interpretation of the Fringe Patterns 319
12.3 Determination of the Fringe Order 319
12.3.1 Determination of Fractional Orders 322
12.3.2 Tardy Compensation Method 322
Contents
12.3.3 Seanarmont Compensation 324
12.3.4 Babinet and Babinet-Soleil Compensators 325
12.4 Relationship between Retardation Changes of Path and Sign of the Stress Differences 327
12.5 Isoclinics and Lines of Principal Stress Trajectories 328
12.6 Utilization of White Light in Photoelasticity 333
12.7 Determination of the Sign of the Boundary Stresses 338
12.7.1 Calibration of the Polariscope 338
12.7.2 Utilization of the FT Algorithms 339
12.7.3 Errors in the Application of the Full Field Method Utilizing the FT 341
12.8 Phase Stepping Techniques 342
12.9 RGB Photoelasticity 343
12.9.1 The RGB Method as a Multi-Channel Method for Phase Stepping 344
12.9.2 Observations on the Recorded Patterns 347
12.9.3 Effect of Dispersion on the Measured Values 348
12.9.4 Phase Stepping Utilizing Monochromatic Light 352
12.9.5 Phase Stepping Utilizing White Light 353
12.10 Reflection Photoelasticity 355
12.10.1 Introduction 355
12.10.2 Reflection Polariscope 356
12.10.3 Utilization of the Coating to Measure Strains 358
12.10.4 Calibration of the Photoelastic Constant Utilizing a Cantilever Beam 359
12.10.5 Practical Problems in the Utilization of Photoelastic Coatings 361
12.10.6 Reinforcing Effects of Coatings 363
12.10.7 Application of the Coating 364
12.11 Full Field Analysis 364
12.12 Three Dimensional Analysis 366
12.12.1 Propagation of Light Beams in 3D 367
12.12.2 The Stress Freezing Method 370
12.12.3 Scattered Light Photoelasticity 371
12.13 Integrated Photoelasticity 375
12.13.1 Linearized Solution Yll
12.13.2 Experimental Technique 379
12.14 Dynamic Photoelasticity 380
12.14.1 Technology to Record High Speed Events 381
12.14.2 CCD and CMOS 382
12.14.3 Harmonic Type of Dynamic Events 383
References 383
13 Techniques that Measure Displacements 387
13.1 Introduction 387
13.2 Formation of Moire Patterns. One Dimensional Case 388
13.3 Formation of Moire Patterns. Two Dimensional Case 390
13.4 Relationship of the Displacement Vector and the Strain Tensor Components 393
13.5 Properties of the Moire Fringes (Isothetic Lines) 395
13.6 Sections of the Surface of Projected Displacements 396
13.6.1 Sign Determination 398
13.6.2 Determining Derivative Signs Directly from Moire Patterns 399
13.7 Singular Points and Singular Lines 401
13.8 Digital Moire 402
13.8.1 Carrier and Moire Fringes as Phase Modulated Signals 402
Contents
13.8.2 Generalization to Two Dimensions of the Equations Relating Moire Patterns
to Displacements 405
13.8.3 Limits to the Continuous Optical Law 408
13.9 Equipment Required to Apply the Moire Method for Displacement and Strain
Determination Utilizing Incoherent Illumination 412
13.9.1 Printing Gratings on Model Surfaces 413
13.9.2 Optical Arrangements to Generate Incoherent Light Moire Patterns 414
13.9.3 Effect of the Camera in the Captured Image, Gap Effect 415
13.9.4 Application of Moire to 2D Static Problems Using Incoherent Illumination 417
13.10 Strain Analysis at the Sub-Micrometer Scale 419
13.10.1 Fundamental Parameters and Optical Set Up 419
13.10.2 Results of Measurements Made at Sub-Micron Level 421
13.11 Three Dimensional Moire 424
13.11.1 Model Construction. Observation Set Up 424
13.12 Dynamic Moire 426
References 432
14 Moire Method. Coherent Ilumination 435
14.1 Introduction 435
14.2 Moire Interferometry 435
14.3 Optical Developments to Obtain Displacement, Contours and Strain Information 439
14.3.1 Fringe Pattern Separations and Fringe Multiplication 440
14.3.2 Pattern Interpolation 441
14.3.3 Differentiation of the Patterns 442
14.4 Determination of All the Components of the Displacement Vector 3-D
Interferometric Moire 446
14.4.1 Determination of the Components u and v 446
14.4.2 Determination of the w Component 447
14.4.3 Development of a Moire Interferometer Removing the FT Part of the
Original Interferometer 450
14.5 Application of Moire Interferometry to High Temperature Fracture Analysis 451
References 456
15 Shadow Moire Projection Moire - The Basic Relationships 459
15.1 Introduction 459
15.2 Basic Equation of Shadow Moire 460
15.3 Basic Differential Geometry Properties of Surfaces 461
15.4 Connection between Differential Geometry and Moire 463
15.5 Projective Geometry and Projection Moire 467
75.5.7 The Pinhole Camera Model 467
15.6 Epipolar Model of the Two Projectors and One Camera System 469
15.7 Approaches to Extend the Moire Method to More General Conditions of Projection
and Observation 471
15.7.1 Pitch of a Grating Projected from a Point Source on the Reference Plane 475
15.7.2 Removal of the Effect of the Projection from a Point Source 477
15.7.3 General Formulation of the Contouring Problem 478
15.7.4 Merging of the Observed Patterns to a Common Coordinate System 481
15.8 Summary of the Chapter 482
References 482
Contents
16 Moire Contouring Applications 485
16.1 Introduction 485
16.2 Basic Principles of Optical Contouring Measuring Devices 486
16.3 Contouring Methods that Utilize Projected Carriers 486
16.4 Parallax Determination in an Area 489
16.5 Mathematical Modeling of the Parallax Determination in an Area 490
16.5.1 Utilization of Several Cameras and Projectors 492
16.6 Limitations of the Contouring Model 492
16.7 Applications of the Contouring Methods 494
16.7.1 Application of 1 Camera and 1 Projector Systems: Contouring Large Slope
Surfaces 495
16.7.2 Application of 1 Camera and 1 Projector Systems: Deformation
Measurements of Flat Surfaces 501
16.8 Double Projector System with Slope and Depth-of-Focus Corrections 506
16.8.1 Deflection Measurement of Large-Size Composite Panel 508
16.8.2 Contouring of Selective Laser Sintering Sample 512
16.8.3 Determination of the Geometric Primitives for the Stereolithographic Sample 514
16.9 Sensitivity Limits for Contouring Methods 518
References 520
17 Reflection Moire 523
17.1 Introduction 523
17.2 Incoherent Illumination. Derivation of the Fundamental Relationship 523
17.2.1 Optical Set-Ups to Observe Slope Fringes in Incoherent Illumination 525
17.3 Interferometric Reflection Moire 526
17.3.1 Derivation of the Equation of the Interferometric Reflection Moire Fringes 527
17.4 Analysis of the Sensitivity that can be Achieved with the Described Setups 530
17.5 Determination of the Deflection of Surfaces Using Reflection Moire 531
17.6 Applications of the Reflection Moire Method 532
17.6.1 Measurement of Residual Stresses in Electronic Chips 534
17.6.2 Examples. Finished Wafer 534
17.6.3 Curvatures of the Chips 536
17.7 Reflection Moire Application - Analysis of a Shell 539
References 545
18 Speckle Patterns and Their Properties 547
18.1 Introduction 547
18.2 First Order Statistics 550
18.2.1 Additional Statistical Results 553
18.2.2 Addition in Intensity of a Uniform Background 553
18.2.3 Second Order Statistics. Objective Speckle Field 554
18.2.4 Extension of the Results Obtained in the Objective Speckle Field to the
Subjective Speckle Field 556
18.3 Three Dimensional Structure of Speckle Patterns 558
18.4 Sensor Effect on Speckle Statistics 560
18.5 Utilization of Speckles to Measure Displacements. Speckle Interferometry 562
18.6 Decorrelation Phenomena 564
18.7 Model for the Formation of the Interference Fringes 567
18.8 Integrated Regime. Metaspeckle 569
18.9 Sensitivity Vector 572
Contents
18.10 Speckle Techniques Set-Ups 573
18.10.1 The Double Beam Interferometer 573
18.10.2 Out-of-Plane Component 576
18.11 Out-of-Plane Interferometer 576
18.12 Shear Interferometry (Shearography) 577
18.13 Contouring Interferometer 578
18.14 Double Viewing. Duffy Double Aperture Method 579
References 581
19 Speckle 2 583
19.1 Speckle Photography 583
19.2 Point-Wise Observation of the Speckle Field 584
19.3 Global View 585
19.4 Different Set-Ups for Speckle Photography 589
19.5 Applications of Speckle Interferometry 590
19.5.1 Data Recording and Processing 590
19.5.2 Extension of the Range of Applied Loading 592
19.6 High Temperature Strain Measurement 593
19.7 Four Beam Interferometer Sensitive to in Plane Displacements 597
19.7.1 Interfacial Deformation between Particles and Matrix in Particle
Reinforced Composites 598
19.7.2 Stress Analysis ofWeldments and Verification of Finite Element
Method Results 601
19.7.3 Measurement of Mechanical Properties in Specimens of Micron
Size Dimensions 604
References 606
20 Digital Image Correlation (DIC) 607
20.1 Introduction 607
20.2 Process to Obtain the Displacement Information 608
20.3 Basic Formulation of the Problem 610
20.4 Introduction of Smoothing Functions to Solve the Optimization Problem 613
20.4.1 Application of the Bicubic Spline Method to the Optimization Problem
in DIC 615
20.5 Determination of the Components of the Displacement Vector 618
20.6 Important Factors that Influence the Packages of DIC 619
20.7 Evaluation of the DIC Method 621
20.8 Double Viewing DIC. Stereo Vision 627
References 628
21 Holographic Interferometry 631
21.1 Holography 631
21.2 Basic Elements of the Holographic Process 632
21.2.1 Recording a Hologram 632
21.2.2 Reconstruction of the Hologram 633
21.3 Properties of Holograms 634
21.4 Set up to Record Holograms 636
21.4.1 Recording Media 640
21.4.2 Speckles Presence in Hologram Recordings 640
Contents
21.5 Holographic Interferometry 641
21.5.1 Analysis of the Formation of Holographic Fringes 642
21.6 Derivation of the Equation of the Sensitivity Vector 644
21.7 Measuring Displacements 646
21.8 Holographic Moire 651
21.9 Lens Holography 658
21.9.1 Fringe Spacing of the Fictitious Displacement, Fringes and Fringe
Localization 660
21.10 Holographic Moire. Real Time Observation 661
21.11 Displacement Analysis of Curved Surfaces 665
21.11.1 Analysis of a Pipe under Internal Pressure 668
21.12 Holographic Contouring 669
21.12.1 Factors Influencing the Separation of Fringes 671
21.13 Measurement of Displacements in 3D of Transparent Bodies 675
21.14 Fiber Optics Version of the Holographic Moire System 675
References 677
22 Digital and Dynamic Holography 681
22.1 Digital Holography 681
22.1.1 Digital Holographic Interferometry 684
22.2 Determination of Strains from 3D Holographic Moire Interferograms 685
22.3 Introduction to Dynamic Holographic Interferometry 689
22 J.7 Vibration Phenomena in Holographic Interferometry 689
22.3.2 Sinusoidal Vibrations 690
22.3.3 Holoraphic Interferometry Fringes 692
22.3.4 Stroboscopic Illumination 692
22.4 Vibration Analysis 693
22.5 Experimental Set up for Time Average Holography 695
22.5.1 Experimental Procedure to Obtain Resonant Modes of a Turbine Blade 696
22.5.2 Experimental Set up to Record Dynamical Holograms with Stroboscopic
Illumination 696
22.5.3 Holographic Set up to Obtain Strain and Stresses of a Vibrating Blade 697
22.5.4 Vibration Modes and Stress Analysis of the SRB-SPU Turbine of the Space
Shuttle 697
22.6 Investigation on Fracture Behavior of Turbine Blades Under Self-Exciting Modes 700
22.6.1 Experimental Technique for Vibration Analysis 702
22.7 Dynamic Holographic Interferometry. Impact Analysis. Wave Propagation 708
22.7.7 Lasers Utilized in Dynamic Holographic Interferometry 709
22.7.2 Applications of Pulsed Holographic Interferometry 709
22.8 Applications of Dynamic Holographic Interferometry 712
22.8.1 Application to Non Destructive Evaluation 712
References 721
Index 723
|
| any_adam_object | 1 |
| author | Sciammarella, Cesar A. Sciammarella, Federico M. |
| author_facet | Sciammarella, Cesar A. Sciammarella, Federico M. |
| author_role | aut aut |
| author_sort | Sciammarella, Cesar A. |
| author_variant | c a s ca cas f m s fm fms |
| building | Verbundindex |
| bvnumber | BV040116856 |
| callnumber-first | T - Technology |
| callnumber-label | TA405 |
| callnumber-raw | TA405 |
| callnumber-search | TA405 |
| callnumber-sort | TA 3405 |
| callnumber-subject | TA - General and Civil Engineering |
| classification_rvk | UF 2000 |
| ctrlnum | (OCoLC)809060969 (DE-599)BVBBV040116856 |
| dewey-full | 620.1/05 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 620 - Engineering and allied operations |
| dewey-raw | 620.1/05 |
| dewey-search | 620.1/05 |
| dewey-sort | 3620.1 15 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Physik |
| edition | 1. publ. |
| format | Book |
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| id | DE-604.BV040116856 |
| illustrated | Illustrated |
| indexdate | 2024-12-20T16:08:27Z |
| institution | BVB |
| isbn | 9780470689530 |
| language | English |
| lccn | 2011038404 |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-024973031 |
| oclc_num | 809060969 |
| open_access_boolean | |
| owner | DE-11 |
| owner_facet | DE-11 |
| physical | XVI, 743 S. Ill., graph. Darst. |
| publishDate | 2012 |
| publishDateSearch | 2012 |
| publishDateSort | 2012 |
| publisher | John Wiley |
| record_format | marc |
| spellingShingle | Sciammarella, Cesar A. Sciammarella, Federico M. Experimental mechanics of solids Strength of materials Solids Mechanical properties Structural analysis (Engineering) Festkörpermechanik (DE-588)4129367-8 gnd |
| subject_GND | (DE-588)4129367-8 |
| title | Experimental mechanics of solids |
| title_auth | Experimental mechanics of solids |
| title_exact_search | Experimental mechanics of solids |
| title_full | Experimental mechanics of solids Cesar A. Sciammarella ; Fedeerico M. Sciammarella |
| title_fullStr | Experimental mechanics of solids Cesar A. Sciammarella ; Fedeerico M. Sciammarella |
| title_full_unstemmed | Experimental mechanics of solids Cesar A. Sciammarella ; Fedeerico M. Sciammarella |
| title_short | Experimental mechanics of solids |
| title_sort | experimental mechanics of solids |
| topic | Strength of materials Solids Mechanical properties Structural analysis (Engineering) Festkörpermechanik (DE-588)4129367-8 gnd |
| topic_facet | Strength of materials Solids Mechanical properties Structural analysis (Engineering) Festkörpermechanik |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=024973031&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT sciammarellacesara experimentalmechanicsofsolids AT sciammarellafedericom experimentalmechanicsofsolids |