Reliability, yield, and stress burn-in: a unified approach for microelectronics systems manufacturing & software development
Gespeichert in:
| Beteiligte Personen: | , , |
|---|---|
| Format: | Buch |
| Sprache: | Englisch |
| Veröffentlicht: |
Boston [u.a.]
Kluwer
1998
|
| Schlagwörter: | |
| Umfang: | XXVI, 394 S. graph. Darst. |
| ISBN: | 0792381076 |
Internformat
MARC
| LEADER | 00000nam a2200000 c 4500 | ||
|---|---|---|---|
| 001 | BV013150024 | ||
| 003 | DE-604 | ||
| 005 | 20100525 | ||
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| 041 | 0 | |a eng | |
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| 050 | 0 | |a TK7874 | |
| 082 | 0 | |a 621.381 |2 21 | |
| 100 | 1 | |a Kuo, Way |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Reliability, yield, and stress burn-in |b a unified approach for microelectronics systems manufacturing & software development |c by Way Kuo, Wei-Ting Kary Chien, Taeho Kim |
| 264 | 1 | |a Boston [u.a.] |b Kluwer |c 1998 | |
| 300 | |a XXVI, 394 S. |b graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 650 | 7 | |a Circuits intégrés - Développement - Fiabilité |2 ram | |
| 650 | 7 | |a Logiciels - Développement - Fiabilité |2 ram | |
| 650 | 7 | |a Microélectronique - Fiabilité |2 ram | |
| 650 | 7 | |a Semiconducteurs - Logiciels - Fiabilité |2 ram | |
| 650 | 4 | |a Computer software |x Development |x Reliability | |
| 650 | 4 | |a Integrated circuits |x Design and construction |x Reliability | |
| 650 | 4 | |a Microelectronics |x Reliability | |
| 650 | 4 | |a Semiconductors |x Computer programs |x Reliability | |
| 650 | 0 | 7 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Zuverlässigkeit |0 (DE-588)4059245-5 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |D s |
| 689 | 0 | 1 | |a Zuverlässigkeit |0 (DE-588)4059245-5 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Chien, Wei-Ting Kary |e Verfasser |4 aut | |
| 700 | 1 | |a Kim, Taeho |e Verfasser |4 aut | |
| 943 | 1 | |a oai:aleph.bib-bvb.de:BVB01-008959184 | |
Datensatz im Suchindex
| _version_ | 1818955691291836416 |
|---|---|
| any_adam_object | |
| author | Kuo, Way Chien, Wei-Ting Kary Kim, Taeho |
| author_facet | Kuo, Way Chien, Wei-Ting Kary Kim, Taeho |
| author_role | aut aut aut |
| author_sort | Kuo, Way |
| author_variant | w k wk w t k c wtk wtkc t k tk |
| building | Verbundindex |
| bvnumber | BV013150024 |
| callnumber-first | T - Technology |
| callnumber-label | TK7874 |
| callnumber-raw | TK7874 |
| callnumber-search | TK7874 |
| callnumber-sort | TK 47874 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| ctrlnum | (OCoLC)37878683 (DE-599)BVBBV013150024 |
| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV013150024 |
| illustrated | Illustrated |
| indexdate | 2024-12-20T10:42:05Z |
| institution | BVB |
| isbn | 0792381076 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-008959184 |
| oclc_num | 37878683 |
| open_access_boolean | |
| owner | DE-634 |
| owner_facet | DE-634 |
| physical | XXVI, 394 S. graph. Darst. |
| publishDate | 1998 |
| publishDateSearch | 1998 |
| publishDateSort | 1998 |
| publisher | Kluwer |
| record_format | marc |
| spelling | Kuo, Way Verfasser aut Reliability, yield, and stress burn-in a unified approach for microelectronics systems manufacturing & software development by Way Kuo, Wei-Ting Kary Chien, Taeho Kim Boston [u.a.] Kluwer 1998 XXVI, 394 S. graph. Darst. txt rdacontent n rdamedia nc rdacarrier Circuits intégrés - Développement - Fiabilité ram Logiciels - Développement - Fiabilité ram Microélectronique - Fiabilité ram Semiconducteurs - Logiciels - Fiabilité ram Computer software Development Reliability Integrated circuits Design and construction Reliability Microelectronics Reliability Semiconductors Computer programs Reliability Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Zuverlässigkeit (DE-588)4059245-5 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 s Zuverlässigkeit (DE-588)4059245-5 s DE-604 Chien, Wei-Ting Kary Verfasser aut Kim, Taeho Verfasser aut |
| spellingShingle | Kuo, Way Chien, Wei-Ting Kary Kim, Taeho Reliability, yield, and stress burn-in a unified approach for microelectronics systems manufacturing & software development Circuits intégrés - Développement - Fiabilité ram Logiciels - Développement - Fiabilité ram Microélectronique - Fiabilité ram Semiconducteurs - Logiciels - Fiabilité ram Computer software Development Reliability Integrated circuits Design and construction Reliability Microelectronics Reliability Semiconductors Computer programs Reliability Elektronisches Bauelement (DE-588)4014360-0 gnd Zuverlässigkeit (DE-588)4059245-5 gnd |
| subject_GND | (DE-588)4014360-0 (DE-588)4059245-5 |
| title | Reliability, yield, and stress burn-in a unified approach for microelectronics systems manufacturing & software development |
| title_auth | Reliability, yield, and stress burn-in a unified approach for microelectronics systems manufacturing & software development |
| title_exact_search | Reliability, yield, and stress burn-in a unified approach for microelectronics systems manufacturing & software development |
| title_full | Reliability, yield, and stress burn-in a unified approach for microelectronics systems manufacturing & software development by Way Kuo, Wei-Ting Kary Chien, Taeho Kim |
| title_fullStr | Reliability, yield, and stress burn-in a unified approach for microelectronics systems manufacturing & software development by Way Kuo, Wei-Ting Kary Chien, Taeho Kim |
| title_full_unstemmed | Reliability, yield, and stress burn-in a unified approach for microelectronics systems manufacturing & software development by Way Kuo, Wei-Ting Kary Chien, Taeho Kim |
| title_short | Reliability, yield, and stress burn-in |
| title_sort | reliability yield and stress burn in a unified approach for microelectronics systems manufacturing software development |
| title_sub | a unified approach for microelectronics systems manufacturing & software development |
| topic | Circuits intégrés - Développement - Fiabilité ram Logiciels - Développement - Fiabilité ram Microélectronique - Fiabilité ram Semiconducteurs - Logiciels - Fiabilité ram Computer software Development Reliability Integrated circuits Design and construction Reliability Microelectronics Reliability Semiconductors Computer programs Reliability Elektronisches Bauelement (DE-588)4014360-0 gnd Zuverlässigkeit (DE-588)4059245-5 gnd |
| topic_facet | Circuits intégrés - Développement - Fiabilité Logiciels - Développement - Fiabilité Microélectronique - Fiabilité Semiconducteurs - Logiciels - Fiabilité Computer software Development Reliability Integrated circuits Design and construction Reliability Microelectronics Reliability Semiconductors Computer programs Reliability Elektronisches Bauelement Zuverlässigkeit |
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