Integrated circuit, hybrid, and multichip module package design guidelines: a focus on reliability
Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost; define the syst...
Gespeichert in:
| Beteilige Person: | |
|---|---|
| Format: | Buch |
| Sprache: | Englisch |
| Veröffentlicht: |
New York u. a.
Wiley
1994
|
| Schriftenreihe: | A Wiley-Interscience publication
|
| Schlagwörter: | |
| Zusammenfassung: | Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost; define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data; identify potential failure modes, sites, mechanisms, and architecture-stress interactions - PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures; characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved; and use experiment, step-stress, and accelerated methods to ensure optimum design before production begins |
| Abstract: | Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals |
| Umfang: | XXXI, 426 S.: Ill. u. graph. Darst. |
| ISBN: | 0471594466 |
Internformat
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| 300 | |a XXXI, 426 S.: Ill. u. graph. Darst. | ||
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| 338 | |b nc |2 rdacarrier | ||
| 490 | 0 | |a A Wiley-Interscience publication | |
| 520 | 3 | |a Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals | |
| 520 | |a Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost; define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data; identify potential failure modes, sites, mechanisms, and architecture-stress interactions - PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures; characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved; and use experiment, step-stress, and accelerated methods to ensure optimum design before production begins | ||
| 650 | 4 | |a Electronic packaging |x Design | |
| 650 | 4 | |a Hybrid integrated circuits |x Design and construction | |
| 650 | 4 | |a Multichip modules (Microelectronics) |x Design and construction | |
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Datensatz im Suchindex
| DE-BY-TUM_call_number | 0001 95 A 1109 |
|---|---|
| DE-BY-TUM_katkey | 650393 |
| DE-BY-TUM_location | Mag |
| DE-BY-TUM_media_number | 040000790809 |
| _version_ | 1821938451094700033 |
| any_adam_object | |
| author | Pecht, Michael |
| author_facet | Pecht, Michael |
| author_role | aut |
| author_sort | Pecht, Michael |
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| building | Verbundindex |
| bvnumber | BV010116832 |
| callnumber-first | T - Technology |
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| callnumber-subject | TK - Electrical and Nuclear Engineering |
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| dewey-full | 621.381/046 |
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| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/046 |
| dewey-search | 621.381/046 |
| dewey-sort | 3621.381 246 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV010116832 |
| illustrated | Not Illustrated |
| indexdate | 2024-12-20T09:48:17Z |
| institution | BVB |
| isbn | 0471594466 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-006717487 |
| oclc_num | 27683155 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM |
| owner_facet | DE-91 DE-BY-TUM |
| physical | XXXI, 426 S.: Ill. u. graph. Darst. |
| publishDate | 1994 |
| publishDateSearch | 1994 |
| publishDateSort | 1994 |
| publisher | Wiley |
| record_format | marc |
| series2 | A Wiley-Interscience publication |
| spellingShingle | Pecht, Michael Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability Electronic packaging Design Hybrid integrated circuits Design and construction Multichip modules (Microelectronics) Design and construction Verbindungstechnik (DE-588)4129183-9 gnd Integrierte Schaltung (DE-588)4027242-4 gnd Bonden (DE-588)4232594-8 gnd |
| subject_GND | (DE-588)4129183-9 (DE-588)4027242-4 (DE-588)4232594-8 |
| title | Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability |
| title_auth | Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability |
| title_exact_search | Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability |
| title_full | Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability Michael Pecht |
| title_fullStr | Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability Michael Pecht |
| title_full_unstemmed | Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability Michael Pecht |
| title_short | Integrated circuit, hybrid, and multichip module package design guidelines |
| title_sort | integrated circuit hybrid and multichip module package design guidelines a focus on reliability |
| title_sub | a focus on reliability |
| topic | Electronic packaging Design Hybrid integrated circuits Design and construction Multichip modules (Microelectronics) Design and construction Verbindungstechnik (DE-588)4129183-9 gnd Integrierte Schaltung (DE-588)4027242-4 gnd Bonden (DE-588)4232594-8 gnd |
| topic_facet | Electronic packaging Design Hybrid integrated circuits Design and construction Multichip modules (Microelectronics) Design and construction Verbindungstechnik Integrierte Schaltung Bonden |
| work_keys_str_mv | AT pechtmichael integratedcircuithybridandmultichipmodulepackagedesignguidelinesafocusonreliability |
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Bibliotheksmagazin
| Signatur: |
0001 95 A 1109 Lageplan |
|---|---|
| Exemplar 1 | Ausleihbar Am Standort |