Micromechanical studies of interface properties in on-chip interconnect structures:
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Thesis/Dissertation Book |
| Language: | English |
| Published: |
Stuttgart
Fraunhofer Verlag
2024
|
| Series: | Schriftenreihe Kompetenzen in Keramik und Materialdiagnostik / Publication series competencies in ceramics and materials diagnostics
5 |
| Subjects: | |
| Links: | http://deposit.dnb.de/cgi-bin/dokserv?id=cee76f0720544f8690a40e39a8b91fd7&prov=M&dok_var=1&dok_ext=htm |
| Physical Description: | 132 Seiten num., mostly col. illus. and tab 21 cm x 14.8 cm |
| ISBN: | 9783839620311 3839620317 |
Staff View
MARC
| LEADER | 00000nam a22000008cb4500 | ||
|---|---|---|---|
| 001 | BV050112670 | ||
| 003 | DE-604 | ||
| 007 | t| | ||
| 008 | 250108s2024 gw a||| m||| 00||| eng d | ||
| 015 | |a 24,N47 |2 dnb | ||
| 016 | 7 | |a 1348171251 |2 DE-101 | |
| 020 | |a 9783839620311 |c : EUR 37.00 (DE), EUR 38.10 (AT), CHF 57.00 (freier Preis) |9 978-3-8396-2031-1 | ||
| 020 | |a 3839620317 |9 3-8396-2031-7 | ||
| 024 | 3 | |a 9783839620311 | |
| 028 | 5 | 2 | |a Bestellnummer: fhg-ikts_95 |
| 035 | |a (DE-599)DNB1348171251 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 044 | |a gw |c XA-DE-BW | ||
| 049 | |a DE-83 | ||
| 084 | |8 1\p |a 620 |2 23sdnb | ||
| 100 | 1 | |a Heyn, Wieland |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Micromechanical studies of interface properties in on-chip interconnect structures |c Wieland Heyn |
| 263 | |a 202411 | ||
| 264 | 1 | |a Stuttgart |b Fraunhofer Verlag |c 2024 | |
| 300 | |a 132 Seiten |b num., mostly col. illus. and tab |c 21 cm x 14.8 cm | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 1 | |a Schriftenreihe Kompetenzen in Keramik und Materialdiagnostik / Publication series competencies in ceramics and materials diagnostics |v 5 | |
| 502 | |b Dissertation |c Technische Universität Dresden |d 2024 | ||
| 653 | |a material science | ||
| 653 | |a microelectronics | ||
| 653 | |a applied sciences | ||
| 653 | |a Elektroingenieure, Mikroelektronikingenieure, Materialwissenschaftler | ||
| 655 | 7 | |0 (DE-588)4113937-9 |a Hochschulschrift |2 gnd-content | |
| 700 | 1 | |a Michaelis, Alexander |4 edt | |
| 710 | 2 | |a Fraunhofer-Institut für Keramische Technologien und Systeme |0 (DE-588)6064165-4 |4 isb | |
| 710 | 2 | |a Fraunhofer IRB-Verlag |0 (DE-588)4786605-6 |4 pbl | |
| 810 | 2 | |a Publication series competencies in ceramics and materials diagnostics |t Schriftenreihe Kompetenzen in Keramik und Materialdiagnostik |v 5 |w (DE-604)BV048394708 |9 5 | |
| 856 | 4 | 2 | |m X:MVB |q text/html |u http://deposit.dnb.de/cgi-bin/dokserv?id=cee76f0720544f8690a40e39a8b91fd7&prov=M&dok_var=1&dok_ext=htm |3 Inhaltstext |
| 883 | 1 | |8 1\p |a vlb |d 20241113 |q DE-101 |u https://d-nb.info/provenance/plan#vlb | |
| 943 | 1 | |a oai:aleph.bib-bvb.de:BVB01-035449636 | |
Record in the Search Index
| _version_ | 1820977722131742720 |
|---|---|
| adam_text | |
| any_adam_object | |
| author | Heyn, Wieland |
| author2 | Michaelis, Alexander |
| author2_role | edt |
| author2_variant | a m am |
| author_facet | Heyn, Wieland Michaelis, Alexander |
| author_role | aut |
| author_sort | Heyn, Wieland |
| author_variant | w h wh |
| building | Verbundindex |
| bvnumber | BV050112670 |
| ctrlnum | (DE-599)DNB1348171251 |
| format | Thesis Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>00000nam a22000008cb4500</leader><controlfield tag="001">BV050112670</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="007">t|</controlfield><controlfield tag="008">250108s2024 gw a||| m||| 00||| eng d</controlfield><datafield tag="015" ind1=" " ind2=" "><subfield code="a">24,N47</subfield><subfield code="2">dnb</subfield></datafield><datafield tag="016" ind1="7" ind2=" "><subfield code="a">1348171251</subfield><subfield code="2">DE-101</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783839620311</subfield><subfield code="c">: EUR 37.00 (DE), EUR 38.10 (AT), CHF 57.00 (freier Preis)</subfield><subfield code="9">978-3-8396-2031-1</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">3839620317</subfield><subfield code="9">3-8396-2031-7</subfield></datafield><datafield tag="024" ind1="3" ind2=" "><subfield code="a">9783839620311</subfield></datafield><datafield tag="028" ind1="5" ind2="2"><subfield code="a">Bestellnummer: fhg-ikts_95</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)DNB1348171251</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="044" ind1=" " ind2=" "><subfield code="a">gw</subfield><subfield code="c">XA-DE-BW</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-83</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="8">1\p</subfield><subfield code="a">620</subfield><subfield code="2">23sdnb</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Heyn, Wieland</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Micromechanical studies of interface properties in on-chip interconnect structures</subfield><subfield code="c">Wieland Heyn</subfield></datafield><datafield tag="263" ind1=" " ind2=" "><subfield code="a">202411</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Stuttgart</subfield><subfield code="b">Fraunhofer Verlag</subfield><subfield code="c">2024</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">132 Seiten</subfield><subfield code="b">num., mostly col. illus. and tab</subfield><subfield code="c">21 cm x 14.8 cm</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="1" ind2=" "><subfield code="a">Schriftenreihe Kompetenzen in Keramik und Materialdiagnostik / Publication series competencies in ceramics and materials diagnostics</subfield><subfield code="v">5</subfield></datafield><datafield tag="502" ind1=" " ind2=" "><subfield code="b">Dissertation</subfield><subfield code="c">Technische Universität Dresden</subfield><subfield code="d">2024</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">material science</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">microelectronics</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">applied sciences</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">Elektroingenieure, Mikroelektronikingenieure, Materialwissenschaftler</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)4113937-9</subfield><subfield code="a">Hochschulschrift</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Michaelis, Alexander</subfield><subfield code="4">edt</subfield></datafield><datafield tag="710" ind1="2" ind2=" "><subfield code="a">Fraunhofer-Institut für Keramische Technologien und Systeme</subfield><subfield code="0">(DE-588)6064165-4</subfield><subfield code="4">isb</subfield></datafield><datafield tag="710" ind1="2" ind2=" "><subfield code="a">Fraunhofer IRB-Verlag</subfield><subfield code="0">(DE-588)4786605-6</subfield><subfield code="4">pbl</subfield></datafield><datafield tag="810" ind1="2" ind2=" "><subfield code="a">Publication series competencies in ceramics and materials diagnostics</subfield><subfield code="t">Schriftenreihe Kompetenzen in Keramik und Materialdiagnostik</subfield><subfield code="v">5</subfield><subfield code="w">(DE-604)BV048394708</subfield><subfield code="9">5</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">X:MVB</subfield><subfield code="q">text/html</subfield><subfield code="u">http://deposit.dnb.de/cgi-bin/dokserv?id=cee76f0720544f8690a40e39a8b91fd7&prov=M&dok_var=1&dok_ext=htm</subfield><subfield code="3">Inhaltstext</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">vlb</subfield><subfield code="d">20241113</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#vlb</subfield></datafield><datafield tag="943" ind1="1" ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-035449636</subfield></datafield></record></collection> |
| genre | (DE-588)4113937-9 Hochschulschrift gnd-content |
| genre_facet | Hochschulschrift |
| id | DE-604.BV050112670 |
| illustrated | Illustrated |
| indexdate | 2025-01-11T18:21:23Z |
| institution | BVB |
| institution_GND | (DE-588)6064165-4 (DE-588)4786605-6 |
| isbn | 9783839620311 3839620317 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-035449636 |
| open_access_boolean | |
| owner | DE-83 |
| owner_facet | DE-83 |
| physical | 132 Seiten num., mostly col. illus. and tab 21 cm x 14.8 cm |
| publishDate | 2024 |
| publishDateSearch | 2024 |
| publishDateSort | 2024 |
| publisher | Fraunhofer Verlag |
| record_format | marc |
| series2 | Schriftenreihe Kompetenzen in Keramik und Materialdiagnostik / Publication series competencies in ceramics and materials diagnostics |
| spelling | Heyn, Wieland Verfasser aut Micromechanical studies of interface properties in on-chip interconnect structures Wieland Heyn 202411 Stuttgart Fraunhofer Verlag 2024 132 Seiten num., mostly col. illus. and tab 21 cm x 14.8 cm txt rdacontent n rdamedia nc rdacarrier Schriftenreihe Kompetenzen in Keramik und Materialdiagnostik / Publication series competencies in ceramics and materials diagnostics 5 Dissertation Technische Universität Dresden 2024 material science microelectronics applied sciences Elektroingenieure, Mikroelektronikingenieure, Materialwissenschaftler (DE-588)4113937-9 Hochschulschrift gnd-content Michaelis, Alexander edt Fraunhofer-Institut für Keramische Technologien und Systeme (DE-588)6064165-4 isb Fraunhofer IRB-Verlag (DE-588)4786605-6 pbl Publication series competencies in ceramics and materials diagnostics Schriftenreihe Kompetenzen in Keramik und Materialdiagnostik 5 (DE-604)BV048394708 5 X:MVB text/html http://deposit.dnb.de/cgi-bin/dokserv?id=cee76f0720544f8690a40e39a8b91fd7&prov=M&dok_var=1&dok_ext=htm Inhaltstext 1\p vlb 20241113 DE-101 https://d-nb.info/provenance/plan#vlb |
| spellingShingle | Heyn, Wieland Micromechanical studies of interface properties in on-chip interconnect structures |
| subject_GND | (DE-588)4113937-9 |
| title | Micromechanical studies of interface properties in on-chip interconnect structures |
| title_auth | Micromechanical studies of interface properties in on-chip interconnect structures |
| title_exact_search | Micromechanical studies of interface properties in on-chip interconnect structures |
| title_full | Micromechanical studies of interface properties in on-chip interconnect structures Wieland Heyn |
| title_fullStr | Micromechanical studies of interface properties in on-chip interconnect structures Wieland Heyn |
| title_full_unstemmed | Micromechanical studies of interface properties in on-chip interconnect structures Wieland Heyn |
| title_short | Micromechanical studies of interface properties in on-chip interconnect structures |
| title_sort | micromechanical studies of interface properties in on chip interconnect structures |
| topic_facet | Hochschulschrift |
| url | http://deposit.dnb.de/cgi-bin/dokserv?id=cee76f0720544f8690a40e39a8b91fd7&prov=M&dok_var=1&dok_ext=htm |
| volume_link | (DE-604)BV048394708 |
| work_keys_str_mv | AT heynwieland micromechanicalstudiesofinterfacepropertiesinonchipinterconnectstructures AT michaelisalexander micromechanicalstudiesofinterfacepropertiesinonchipinterconnectstructures AT fraunhoferinstitutfurkeramischetechnologienundsysteme micromechanicalstudiesofinterfacepropertiesinonchipinterconnectstructures AT fraunhoferirbverlag micromechanicalstudiesofinterfacepropertiesinonchipinterconnectstructures |