Heyn, W., & Michaelis, A. (2024). Micromechanical studies of interface properties in on-chip interconnect structures. Fraunhofer Verlag.
Chicago Style (17th ed.) CitationHeyn, Wieland, and Alexander Michaelis. Micromechanical Studies of Interface Properties in On-chip Interconnect Structures. Stuttgart: Fraunhofer Verlag, 2024.
MLA (9th ed.) CitationHeyn, Wieland, and Alexander Michaelis. Micromechanical Studies of Interface Properties in On-chip Interconnect Structures. Fraunhofer Verlag, 2024.
Warning: These citations may not always be 100% accurate.