APA (7th ed.) Citation

Heyn, W., & Michaelis, A. (2024). Micromechanical studies of interface properties in on-chip interconnect structures. Fraunhofer Verlag.

Chicago Style (17th ed.) Citation

Heyn, Wieland, and Alexander Michaelis. Micromechanical Studies of Interface Properties in On-chip Interconnect Structures. Stuttgart: Fraunhofer Verlag, 2024.

MLA (9th ed.) Citation

Heyn, Wieland, and Alexander Michaelis. Micromechanical Studies of Interface Properties in On-chip Interconnect Structures. Fraunhofer Verlag, 2024.

Warning: These citations may not always be 100% accurate.