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Buchumschlag
Gespeichert in:
Bibliographische Detailangaben
Weitere beteiligte Personen: Mishra, Ashutosh (HerausgeberIn), Cha, Jaekwang (HerausgeberIn), Park, Hyunbin (HerausgeberIn), Kim, Shiho (HerausgeberIn)
Format: Elektronisch E-Book
Sprache:Englisch
Veröffentlicht: Cham Springer International Publishing 2023
Cham Springer
Ausgabe:1st ed. 2023
Schlagwörter:
Electronic Circuits and Systems
Cyber-Physical Systems
Artificial Intelligence
Electronic circuits
Cooperating objects (Computer systems)
Artificial intelligence
Links:https://doi.org/10.1007/978-3-031-22170-5
https://doi.org/10.1007/978-3-031-22170-5
https://doi.org/10.1007/978-3-031-22170-5
https://doi.org/10.1007/978-3-031-22170-5
https://doi.org/10.1007/978-3-031-22170-5
https://doi.org/10.1007/978-3-031-22170-5
https://doi.org/10.1007/978-3-031-22170-5
https://doi.org/10.1007/978-3-031-22170-5
https://doi.org/10.1007/978-3-031-22170-5
https://doi.org/10.1007/978-3-031-22170-5
https://doi.org/10.1007/978-3-031-22170-5
https://doi.org/10.1007/978-3-031-22170-5
https://doi.org/10.1007/978-3-031-22170-5
https://doi.org/10.1007/978-3-031-22170-5
https://doi.org/10.1007/978-3-031-22170-5
https://doi.org/10.1007/978-3-031-22170-5
https://doi.org/10.1007/978-3-031-22170-5
https://doi.org/10.1007/978-3-031-22170-5
https://doi.org/10.1007/978-3-031-22170-5
https://doi.org/10.1007/978-3-031-22170-5
Umfang:1 Online-Ressource (VII, 357 p. 237 illus., 202 illus. in color)
ISBN:9783031221705
DOI:10.1007/978-3-031-22170-5
Internformat

MARC

LEADER 00000nam a2200000zc 4500
001 BV048886460
003 DE-604
005 00000000000000.0
007 cr|uuu---uuuuu
008 230403s2023 xx o|||| 00||| eng d
020 |a 9783031221705  |c Online  |9 978-3-031-22170-5 
024 7 |a 10.1007/978-3-031-22170-5  |2 doi 
035 |a (ZDB-2-ENG)9783031221705 
035 |a (OCoLC)1376405340 
035 |a (DE-599)BVBBV048886460 
040 |a DE-604  |b ger  |e rda 
041 0 |a eng 
049 |a DE-1043  |a DE-860  |a DE-91  |a DE-858  |a DE-1046  |a DE-Aug4  |a DE-898  |a DE-861  |a DE-523  |a DE-859  |a DE-29  |a DE-863  |a DE-1050  |a DE-862  |a DE-92  |a DE-573  |a DE-M347  |a DE-706  |a DE-634 
082 0 |a 621.3815  |2 23 
084 |a ELT 000  |2 stub 
084 |a MAS 000  |2 stub 
245 1 0 |a Artificial Intelligence and Hardware Accelerators  |c edited by Ashutosh Mishra, Jaekwang Cha, Hyunbin Park, Shiho Kim 
250 |a 1st ed. 2023 
264 1 |a Cham  |b Springer International Publishing  |c 2023 
264 1 |a Cham  |b Springer 
300 |a 1 Online-Ressource (VII, 357 p. 237 illus., 202 illus. in color) 
336 |b txt  |2 rdacontent 
337 |b c  |2 rdamedia 
338 |b cr  |2 rdacarrier 
650 4 |a Electronic Circuits and Systems 
650 4 |a Cyber-Physical Systems 
650 4 |a Artificial Intelligence 
650 4 |a Electronic circuits 
650 4 |a Cooperating objects (Computer systems) 
650 4 |a Artificial intelligence 
700 1 |a Mishra, Ashutosh  |4 edt 
700 1 |a Cha, Jaekwang  |4 edt 
700 1 |a Park, Hyunbin  |4 edt 
700 1 |a Kim, Shiho  |4 edt 
776 0 8 |i Erscheint auch als  |n Druck-Ausgabe  |z 978-3-031-22169-9 
776 0 8 |i Erscheint auch als  |n Druck-Ausgabe  |z 978-3-031-22171-2 
776 0 8 |i Erscheint auch als  |n Druck-Ausgabe  |z 978-3-031-22172-9 
856 4 0 |u https://doi.org/10.1007/978-3-031-22170-5  |x Verlag  |z URL des Erstveröffentlichers  |3 Volltext 
912 |a ZDB-2-ENG 
940 1 |q ZDB-2-ENG_2023 
943 1 |a oai:aleph.bib-bvb.de:BVB01-034151104 
966 e |u https://doi.org/10.1007/978-3-031-22170-5  |l DE-634  |p ZDB-2-ENG  |x Verlag  |3 Volltext 
966 e |u https://doi.org/10.1007/978-3-031-22170-5  |l DE-1043  |p ZDB-2-ENG  |x Verlag  |3 Volltext 
966 e |u https://doi.org/10.1007/978-3-031-22170-5  |l DE-1046  |p ZDB-2-ENG  |x Verlag  |3 Volltext 
966 e |u https://doi.org/10.1007/978-3-031-22170-5  |l DE-858  |p ZDB-2-ENG  |x Verlag  |3 Volltext 
966 e |u https://doi.org/10.1007/978-3-031-22170-5  |l DE-Aug4  |p ZDB-2-ENG  |x Verlag  |3 Volltext 
966 e |u https://doi.org/10.1007/978-3-031-22170-5  |l DE-1050  |p ZDB-2-ENG  |x Verlag  |3 Volltext 
966 e |u https://doi.org/10.1007/978-3-031-22170-5  |l DE-573  |p ZDB-2-ENG  |x Verlag  |3 Volltext 
966 e |u https://doi.org/10.1007/978-3-031-22170-5  |l DE-M347  |p ZDB-2-ENG  |x Verlag  |3 Volltext 
966 e |u https://doi.org/10.1007/978-3-031-22170-5  |l DE-92  |p ZDB-2-ENG  |x Verlag  |3 Volltext 
966 e |u https://doi.org/10.1007/978-3-031-22170-5  |l DE-898  |p ZDB-2-ENG  |x Verlag  |3 Volltext 
966 e |u https://doi.org/10.1007/978-3-031-22170-5  |l DE-859  |p ZDB-2-ENG  |x Verlag  |3 Volltext 
966 e |u https://doi.org/10.1007/978-3-031-22170-5  |l DE-860  |p ZDB-2-ENG  |x Verlag  |3 Volltext 
966 e |u https://doi.org/10.1007/978-3-031-22170-5  |l DE-861  |p ZDB-2-ENG  |x Verlag  |3 Volltext 
966 e |u https://doi.org/10.1007/978-3-031-22170-5  |l DE-863  |p ZDB-2-ENG  |x Verlag  |3 Volltext 
966 e |u https://doi.org/10.1007/978-3-031-22170-5  |l DE-862  |p ZDB-2-ENG  |x Verlag  |3 Volltext 
966 e |u https://doi.org/10.1007/978-3-031-22170-5  |l DE-523  |p ZDB-2-ENG  |x Verlag  |3 Volltext 
966 e |u https://doi.org/10.1007/978-3-031-22170-5  |l DE-91  |p ZDB-2-ENG  |x Verlag  |3 Volltext 
966 e |u https://doi.org/10.1007/978-3-031-22170-5  |l DE-706  |p ZDB-2-ENG  |x Verlag  |3 Volltext 
966 e |u https://doi.org/10.1007/978-3-031-22170-5  |l DE-29  |p ZDB-2-ENG  |x Verlag  |3 Volltext 

Datensatz im Suchindex

DE-BY-OTHR_katkey 6670215
DE-BY-TUM_katkey 2722634
_version_ 1831257722937409537
any_adam_object
author2 Mishra, Ashutosh
Cha, Jaekwang
Park, Hyunbin
Kim, Shiho
author2_role edt
edt
edt
edt
author2_variant a m am
j c jc
h p hp
s k sk
author_facet Mishra, Ashutosh
Cha, Jaekwang
Park, Hyunbin
Kim, Shiho
building Verbundindex
bvnumber BV048886460
classification_tum ELT 000
MAS 000
collection ZDB-2-ENG
ctrlnum (ZDB-2-ENG)9783031221705
(OCoLC)1376405340
(DE-599)BVBBV048886460
dewey-full 621.3815
dewey-hundreds 600 - Technology (Applied sciences)
dewey-ones 621 - Applied physics
dewey-raw 621.3815
dewey-search 621.3815
dewey-sort 3621.3815
dewey-tens 620 - Engineering and allied operations
discipline Maschinenbau / Maschinenwesen
Elektrotechnik / Elektronik / Nachrichtentechnik
doi_str_mv 10.1007/978-3-031-22170-5
edition 1st ed. 2023
format Electronic
eBook
fullrecord <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03762nam a2200745zc 4500</leader><controlfield tag="001">BV048886460</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">230403s2023 xx o|||| 00||| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783031221705</subfield><subfield code="c">Online</subfield><subfield code="9">978-3-031-22170-5</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/978-3-031-22170-5</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-2-ENG)9783031221705</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1376405340</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV048886460</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-1043</subfield><subfield code="a">DE-860</subfield><subfield code="a">DE-91</subfield><subfield code="a">DE-858</subfield><subfield code="a">DE-1046</subfield><subfield code="a">DE-Aug4</subfield><subfield code="a">DE-898</subfield><subfield code="a">DE-861</subfield><subfield code="a">DE-523</subfield><subfield code="a">DE-859</subfield><subfield code="a">DE-29</subfield><subfield code="a">DE-863</subfield><subfield code="a">DE-1050</subfield><subfield code="a">DE-862</subfield><subfield code="a">DE-92</subfield><subfield code="a">DE-573</subfield><subfield code="a">DE-M347</subfield><subfield code="a">DE-706</subfield><subfield code="a">DE-634</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.3815</subfield><subfield code="2">23</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ELT 000</subfield><subfield code="2">stub</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">MAS 000</subfield><subfield code="2">stub</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Artificial Intelligence and Hardware Accelerators</subfield><subfield code="c">edited by Ashutosh Mishra, Jaekwang Cha, Hyunbin Park, Shiho Kim</subfield></datafield><datafield tag="250" ind1=" " ind2=" "><subfield code="a">1st ed. 2023</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Cham</subfield><subfield code="b">Springer International Publishing</subfield><subfield code="c">2023</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Cham</subfield><subfield code="b">Springer</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (VII, 357 p. 237 illus., 202 illus. in color)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic Circuits and Systems</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Cyber-Physical Systems</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Artificial Intelligence</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic circuits</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Cooperating objects (Computer systems)</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Artificial intelligence</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Mishra, Ashutosh</subfield><subfield code="4">edt</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Cha, Jaekwang</subfield><subfield code="4">edt</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Park, Hyunbin</subfield><subfield code="4">edt</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Kim, Shiho</subfield><subfield code="4">edt</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">978-3-031-22169-9</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">978-3-031-22171-2</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">978-3-031-22172-9</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1007/978-3-031-22170-5</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-2-ENG</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">ZDB-2-ENG_2023</subfield></datafield><datafield tag="943" ind1="1" ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-034151104</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-031-22170-5</subfield><subfield code="l">DE-634</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-031-22170-5</subfield><subfield code="l">DE-1043</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-031-22170-5</subfield><subfield code="l">DE-1046</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-031-22170-5</subfield><subfield code="l">DE-858</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-031-22170-5</subfield><subfield code="l">DE-Aug4</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-031-22170-5</subfield><subfield code="l">DE-1050</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-031-22170-5</subfield><subfield code="l">DE-573</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-031-22170-5</subfield><subfield code="l">DE-M347</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-031-22170-5</subfield><subfield code="l">DE-92</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-031-22170-5</subfield><subfield code="l">DE-898</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-031-22170-5</subfield><subfield code="l">DE-859</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-031-22170-5</subfield><subfield code="l">DE-860</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-031-22170-5</subfield><subfield code="l">DE-861</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-031-22170-5</subfield><subfield code="l">DE-863</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-031-22170-5</subfield><subfield code="l">DE-862</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-031-22170-5</subfield><subfield code="l">DE-523</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-031-22170-5</subfield><subfield code="l">DE-91</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-031-22170-5</subfield><subfield code="l">DE-706</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-031-22170-5</subfield><subfield code="l">DE-29</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection>
id DE-604.BV048886460
illustrated Not Illustrated
indexdate 2024-12-20T19:54:46Z
institution BVB
isbn 9783031221705
language English
oai_aleph_id oai:aleph.bib-bvb.de:BVB01-034151104
oclc_num 1376405340
open_access_boolean
owner DE-1043
DE-860
DE-91
DE-BY-TUM
DE-858
DE-1046
DE-Aug4
DE-898
DE-BY-UBR
DE-861
DE-523
DE-859
DE-29
DE-863
DE-BY-FWS
DE-1050
DE-862
DE-BY-FWS
DE-92
DE-573
DE-M347
DE-706
DE-634
owner_facet DE-1043
DE-860
DE-91
DE-BY-TUM
DE-858
DE-1046
DE-Aug4
DE-898
DE-BY-UBR
DE-861
DE-523
DE-859
DE-29
DE-863
DE-BY-FWS
DE-1050
DE-862
DE-BY-FWS
DE-92
DE-573
DE-M347
DE-706
DE-634
physical 1 Online-Ressource (VII, 357 p. 237 illus., 202 illus. in color)
psigel ZDB-2-ENG
ZDB-2-ENG_2023
publishDate 2023
publishDateSearch 2023
publishDateSort 2023
publisher Springer International Publishing
Springer
record_format marc
spellingShingle Artificial Intelligence and Hardware Accelerators
Electronic Circuits and Systems
Cyber-Physical Systems
Artificial Intelligence
Electronic circuits
Cooperating objects (Computer systems)
Artificial intelligence
title Artificial Intelligence and Hardware Accelerators
title_auth Artificial Intelligence and Hardware Accelerators
title_exact_search Artificial Intelligence and Hardware Accelerators
title_full Artificial Intelligence and Hardware Accelerators edited by Ashutosh Mishra, Jaekwang Cha, Hyunbin Park, Shiho Kim
title_fullStr Artificial Intelligence and Hardware Accelerators edited by Ashutosh Mishra, Jaekwang Cha, Hyunbin Park, Shiho Kim
title_full_unstemmed Artificial Intelligence and Hardware Accelerators edited by Ashutosh Mishra, Jaekwang Cha, Hyunbin Park, Shiho Kim
title_short Artificial Intelligence and Hardware Accelerators
title_sort artificial intelligence and hardware accelerators
topic Electronic Circuits and Systems
Cyber-Physical Systems
Artificial Intelligence
Electronic circuits
Cooperating objects (Computer systems)
Artificial intelligence
topic_facet Electronic Circuits and Systems
Cyber-Physical Systems
Artificial Intelligence
Electronic circuits
Cooperating objects (Computer systems)
Artificial intelligence
url https://doi.org/10.1007/978-3-031-22170-5
work_keys_str_mv AT mishraashutosh artificialintelligenceandhardwareaccelerators
AT chajaekwang artificialintelligenceandhardwareaccelerators
AT parkhyunbin artificialintelligenceandhardwareaccelerators
AT kimshiho artificialintelligenceandhardwareaccelerators
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