Gespeichert in:
| Beteiligte Personen: | , |
|---|---|
| Format: | Buch |
| Sprache: | Englisch |
| Veröffentlicht: |
Boca Raton ; London ; New York
CRC Press, Taylor & Francis Group
[2019]
|
| Schlagwörter: | |
| Umfang: | xiii, 226 Seiten Illustrationen, Diagramme 24 cm |
| ISBN: | 9780367023430 |
Internformat
MARC
| LEADER | 00000nam a2200000 c 4500 | ||
|---|---|---|---|
| 001 | BV046932292 | ||
| 003 | DE-604 | ||
| 005 | 20201009 | ||
| 007 | t| | ||
| 008 | 201008s2019 xx a||| |||| 00||| eng d | ||
| 015 | |a GBB955239 |2 dnb | ||
| 020 | |a 9780367023430 |c Hardback |9 978-0-367-02343-0 | ||
| 035 | |a (OCoLC)1158499108 | ||
| 035 | |a (DE-599)BVBBV046932292 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-1050 | ||
| 084 | |a ZN 4940 |0 (DE-625)157423: |2 rvk | ||
| 100 | 1 | |a Ma, Yue |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement |c Yue Ma and Christian Gontrand |
| 264 | 1 | |a Boca Raton ; London ; New York |b CRC Press, Taylor & Francis Group |c [2019] | |
| 300 | |a xiii, 226 Seiten |b Illustrationen, Diagramme |c 24 cm | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 650 | 4 | |a Three-dimensional integrated circuits | |
| 650 | 7 | |a Three-dimensional integrated circuits |2 fast | |
| 700 | 1 | |a Gontrand, Christian |e Verfasser |0 (DE-588)1185986553 |4 aut | |
| 943 | 1 | |a oai:aleph.bib-bvb.de:BVB01-032341200 | |
Datensatz im Suchindex
| _version_ | 1818987332518281216 |
|---|---|
| any_adam_object | |
| author | Ma, Yue Gontrand, Christian |
| author_GND | (DE-588)1185986553 |
| author_facet | Ma, Yue Gontrand, Christian |
| author_role | aut aut |
| author_sort | Ma, Yue |
| author_variant | y m ym c g cg |
| building | Verbundindex |
| bvnumber | BV046932292 |
| classification_rvk | ZN 4940 |
| ctrlnum | (OCoLC)1158499108 (DE-599)BVBBV046932292 |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01117nam a2200313 c 4500</leader><controlfield tag="001">BV046932292</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20201009 </controlfield><controlfield tag="007">t|</controlfield><controlfield tag="008">201008s2019 xx a||| |||| 00||| eng d</controlfield><datafield tag="015" ind1=" " ind2=" "><subfield code="a">GBB955239</subfield><subfield code="2">dnb</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9780367023430</subfield><subfield code="c">Hardback</subfield><subfield code="9">978-0-367-02343-0</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1158499108</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV046932292</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-1050</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4940</subfield><subfield code="0">(DE-625)157423:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Ma, Yue</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement</subfield><subfield code="c">Yue Ma and Christian Gontrand</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Boca Raton ; London ; New York</subfield><subfield code="b">CRC Press, Taylor & Francis Group</subfield><subfield code="c">[2019]</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">xiii, 226 Seiten</subfield><subfield code="b">Illustrationen, Diagramme</subfield><subfield code="c">24 cm</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Three-dimensional integrated circuits</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Three-dimensional integrated circuits</subfield><subfield code="2">fast</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Gontrand, Christian</subfield><subfield code="e">Verfasser</subfield><subfield code="0">(DE-588)1185986553</subfield><subfield code="4">aut</subfield></datafield><datafield tag="943" ind1="1" ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-032341200</subfield></datafield></record></collection> |
| id | DE-604.BV046932292 |
| illustrated | Illustrated |
| indexdate | 2024-12-20T19:05:00Z |
| institution | BVB |
| isbn | 9780367023430 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-032341200 |
| oclc_num | 1158499108 |
| open_access_boolean | |
| owner | DE-1050 |
| owner_facet | DE-1050 |
| physical | xiii, 226 Seiten Illustrationen, Diagramme 24 cm |
| publishDate | 2019 |
| publishDateSearch | 2019 |
| publishDateSort | 2019 |
| publisher | CRC Press, Taylor & Francis Group |
| record_format | marc |
| spelling | Ma, Yue Verfasser aut Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement Yue Ma and Christian Gontrand Boca Raton ; London ; New York CRC Press, Taylor & Francis Group [2019] xiii, 226 Seiten Illustrationen, Diagramme 24 cm txt rdacontent n rdamedia nc rdacarrier Three-dimensional integrated circuits Three-dimensional integrated circuits fast Gontrand, Christian Verfasser (DE-588)1185986553 aut |
| spellingShingle | Ma, Yue Gontrand, Christian Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement Three-dimensional integrated circuits Three-dimensional integrated circuits fast |
| title | Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement |
| title_auth | Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement |
| title_exact_search | Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement |
| title_full | Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement Yue Ma and Christian Gontrand |
| title_fullStr | Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement Yue Ma and Christian Gontrand |
| title_full_unstemmed | Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement Yue Ma and Christian Gontrand |
| title_short | Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement |
| title_sort | power thermal noise and signal integrity issues on substrate interconnects entanglement |
| topic | Three-dimensional integrated circuits Three-dimensional integrated circuits fast |
| topic_facet | Three-dimensional integrated circuits |
| work_keys_str_mv | AT mayue powerthermalnoiseandsignalintegrityissuesonsubstrateinterconnectsentanglement AT gontrandchristian powerthermalnoiseandsignalintegrityissuesonsubstrateinterconnectsentanglement |