Encapsulation technologies for electronic applications:
Gespeichert in:
| Beteiligte Personen: | , , |
|---|---|
| Format: | Buch |
| Sprache: | Englisch |
| Veröffentlicht: |
Oxford ; Cambridge
William Andrew, Elsevier
[2019]
|
| Ausgabe: | Second edition |
| Schriftenreihe: | Materials and processes for electronic applications
|
| Schlagwörter: | |
| Umfang: | x, 498 Seiten Illustrationen, Diagramme |
| ISBN: | 9780128119785 |
Internformat
MARC
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|---|---|---|---|
| 001 | BV045326083 | ||
| 003 | DE-604 | ||
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| 007 | t| | ||
| 008 | 181128s2019 xx a||| |||| 00||| eng d | ||
| 020 | |a 9780128119785 |9 978-0-12-811978-5 | ||
| 035 | |a (OCoLC)1083884575 | ||
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| 040 | |a DE-604 |b ger |e rda | ||
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| 100 | 1 | |a Ardebili, Haleh |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Encapsulation technologies for electronic applications |c Haleh Ardebili (University of Houston, Houston, TX, United States), Jiawei Zhang (Qualcomm, San Diego, CA, United States), Michael G. Pecht (CALCE, University of Maryland, College Park, MD, United States) |
| 250 | |a Second edition | ||
| 264 | 1 | |a Oxford ; Cambridge |b William Andrew, Elsevier |c [2019] | |
| 264 | 4 | |c © 2019 | |
| 300 | |a x, 498 Seiten |b Illustrationen, Diagramme | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 0 | |a Materials and processes for electronic applications | |
| 650 | 4 | |a Electronic apparatus and appliances / Plastic embedment | |
| 650 | 0 | 7 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Verkapseln |0 (DE-588)4139497-5 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Gehäuse |0 (DE-588)4156307-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Mikroelektronik |0 (DE-588)4039207-7 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Verkapseln |0 (DE-588)4139497-5 |D s |
| 689 | 0 | 1 | |a Mikroelektronik |0 (DE-588)4039207-7 |D s |
| 689 | 0 | 2 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |D s |
| 689 | 0 | 3 | |a Gehäuse |0 (DE-588)4156307-4 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Zhang, Jiawei |e Verfasser |4 aut | |
| 700 | 1 | |a Pecht, Michael |e Verfasser |0 (DE-588)171714903 |4 aut | |
| 776 | 0 | 8 | |i Erscheint auch als |n Online-Ausgabe |z 978-0-12-811979-2 |
| 943 | 1 | |a oai:aleph.bib-bvb.de:BVB01-030713001 | |
Datensatz im Suchindex
| DE-BY-TUM_call_number | 0702 ELT 296f 2019 A 399(2) |
|---|---|
| DE-BY-TUM_katkey | 2376070 |
| DE-BY-TUM_location | 07 |
| DE-BY-TUM_media_number | 040008852719 |
| _version_ | 1821935884911509504 |
| any_adam_object | |
| author | Ardebili, Haleh Zhang, Jiawei Pecht, Michael |
| author_GND | (DE-588)171714903 |
| author_facet | Ardebili, Haleh Zhang, Jiawei Pecht, Michael |
| author_role | aut aut aut |
| author_sort | Ardebili, Haleh |
| author_variant | h a ha j z jz m p mp |
| building | Verbundindex |
| bvnumber | BV045326083 |
| classification_rvk | ZN 4192 |
| classification_tum | ELT 296f |
| ctrlnum | (OCoLC)1083884575 (DE-599)BVBBV045326083 |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| edition | Second edition |
| format | Book |
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| id | DE-604.BV045326083 |
| illustrated | Illustrated |
| indexdate | 2024-12-20T18:24:05Z |
| institution | BVB |
| isbn | 9780128119785 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030713001 |
| oclc_num | 1083884575 |
| open_access_boolean | |
| owner | DE-91G DE-BY-TUM DE-83 |
| owner_facet | DE-91G DE-BY-TUM DE-83 |
| physical | x, 498 Seiten Illustrationen, Diagramme |
| publishDate | 2019 |
| publishDateSearch | 2019 |
| publishDateSort | 2019 |
| publisher | William Andrew, Elsevier |
| record_format | marc |
| series2 | Materials and processes for electronic applications |
| spellingShingle | Ardebili, Haleh Zhang, Jiawei Pecht, Michael Encapsulation technologies for electronic applications Electronic apparatus and appliances / Plastic embedment Elektronisches Bauelement (DE-588)4014360-0 gnd Verkapseln (DE-588)4139497-5 gnd Gehäuse (DE-588)4156307-4 gnd Mikroelektronik (DE-588)4039207-7 gnd |
| subject_GND | (DE-588)4014360-0 (DE-588)4139497-5 (DE-588)4156307-4 (DE-588)4039207-7 |
| title | Encapsulation technologies for electronic applications |
| title_auth | Encapsulation technologies for electronic applications |
| title_exact_search | Encapsulation technologies for electronic applications |
| title_full | Encapsulation technologies for electronic applications Haleh Ardebili (University of Houston, Houston, TX, United States), Jiawei Zhang (Qualcomm, San Diego, CA, United States), Michael G. Pecht (CALCE, University of Maryland, College Park, MD, United States) |
| title_fullStr | Encapsulation technologies for electronic applications Haleh Ardebili (University of Houston, Houston, TX, United States), Jiawei Zhang (Qualcomm, San Diego, CA, United States), Michael G. Pecht (CALCE, University of Maryland, College Park, MD, United States) |
| title_full_unstemmed | Encapsulation technologies for electronic applications Haleh Ardebili (University of Houston, Houston, TX, United States), Jiawei Zhang (Qualcomm, San Diego, CA, United States), Michael G. Pecht (CALCE, University of Maryland, College Park, MD, United States) |
| title_short | Encapsulation technologies for electronic applications |
| title_sort | encapsulation technologies for electronic applications |
| topic | Electronic apparatus and appliances / Plastic embedment Elektronisches Bauelement (DE-588)4014360-0 gnd Verkapseln (DE-588)4139497-5 gnd Gehäuse (DE-588)4156307-4 gnd Mikroelektronik (DE-588)4039207-7 gnd |
| topic_facet | Electronic apparatus and appliances / Plastic embedment Elektronisches Bauelement Verkapseln Gehäuse Mikroelektronik |
| work_keys_str_mv | AT ardebilihaleh encapsulationtechnologiesforelectronicapplications AT zhangjiawei encapsulationtechnologiesforelectronicapplications AT pechtmichael encapsulationtechnologiesforelectronicapplications |
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Teilbibliothek Maschinenwesen
| Signatur: |
0702 ELT 296f 2019 A 399(2) Lageplan |
|---|---|
| Exemplar 1 | Ausleihbar Am Standort |