Three-dimensional molded interconnect devices (3D-MID): materials, manufacturing, assembly and applications for injection molded circuit carriers
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Bibliographic Details
Main Author: Franke, Jörg 1964- (Author)
Format: Electronic eBook
Language:English
Published: München Hanser 2014
Subjects:
Links:https://doi.org/10.3139/9781569905524?locatt=mode:legacy
https://doi.org/10.3139/9781569905524?locatt=mode:legacy
https://doi.org/10.3139/9781569905524?locatt=mode:legacy
https://doi.org/10.3139/9781569905524?locatt=mode:legacy
https://doi.org/10.3139/9781569905524?locatt=mode:legacy
https://doi.org/10.3139/9781569905524?locatt=mode:legacy
https://doi.org/10.3139/9781569905524?locatt=mode:legacy
https://doi.org/10.3139/9781569905524?locatt=mode:legacy
https://doi.org/10.3139/9781569905524?locatt=mode:legacy
https://doi.org/10.3139/9781569905524
Physical Description:1 Online-Ressource (XII, 356 S.) Ill., graph. Darst.
ISBN:9781569905524
DOI:10.3139/9781569905524