APA (7th ed.) Citation

Franke, J. (2014). Three-dimensional molded interconnect devices (3D-MID): Materials, manufacturing, assembly and applications for injection molded circuit carriers. Hanser. https://doi.org/10.3139/9781569905524

Chicago Style (17th ed.) Citation

Franke, Jörg. Three-dimensional Molded Interconnect Devices (3D-MID): Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers. München: Hanser, 2014. https://doi.org/10.3139/9781569905524.

MLA (9th ed.) Citation

Franke, Jörg. Three-dimensional Molded Interconnect Devices (3D-MID): Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers. Hanser, 2014. https://doi.org/10.3139/9781569905524.