Three-dimensional molded interconnect devices (3D-MID): materials, manufacturing, assembly and applications for injection molded circuit carriers
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| Main Author: | |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
München
Hanser
2014
|
| Subjects: | |
| Links: | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=027283269&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| Physical Description: | XII, 356 S. Ill., graph. Darst. |
| ISBN: | 9781569905517 9781569905524 |
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MARC
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| 245 | 1 | 0 | |a Three-dimensional molded interconnect devices (3D-MID) |b materials, manufacturing, assembly and applications for injection molded circuit carriers |c Jörg Franke |
| 264 | 1 | |a München |b Hanser |c 2014 | |
| 300 | |a XII, 356 S. |b Ill., graph. Darst. | ||
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Record in the Search Index
| DE-BY-TUM_call_number | 0702 ELT 008f 2014 A 6315 |
|---|---|
| DE-BY-TUM_katkey | 2046152 |
| DE-BY-TUM_location | 07 |
| DE-BY-TUM_media_number | 040008430106 |
| _version_ | 1821934019793649665 |
| adam_text | CONTENTS
PREFACE V
1 MID TECHNOLOGY AND MECHATRONIC INTEGRATION POTENTIAL 1
1.1 TECHNOLOGICAL BASICS 1
1.1.1 DEFINITION AND ROOT PRINCIPLE 1
1.1.2 GEOMETRIC CLASSIFICATION 2
1.1.3 POTENTIAL OF 3D-MID TECHNOLOGY 3
1.1.4 MID REFERENCE PROCESS 5
1.1.5 FACTORS INFLUENCING CHOICE OF TECHNOLOGY 6
1.1.6 DIFFERENTIATION FROM RELATED TECHNOLOGY FIELDS 7
1.2 RELEVANT INDUSTRIES AND AREAS OF APPLICATION 8
1.2.1 MID-RELEVANT INDUSTRIES 9
1.2.2 AREAS OF APPLICATION 11
1.3 THE MID MARKET, A GLOBAL COMPARISON 12
1.3.1 HISTORICAL DEVELOPMENT 13
1.3.2 MID FOCUSES BY REGION 14
1.4 MAIN FIELDS OF MID RESEARCH 16
1.5 KEY FACTORS FOR SUCCESSFUL PROJECTS 19
1.6 NETWORK-ORIENTED COOPERATION WITHIN THE RESEARCH ASSOCIATION
MOLDED INTERCONNECT DEVICES (3-D MID) 20
2 MATERIALS FOR 3D-MID 23
2.1 INTRODUCTION TO MID MATERIALS CLASSES 25
2.2 MATERIALS PROPERTIES AND DETERMINATION OF CHARACTERISTIC VALUES
FOR MID 27
2.2.1 MECHANICAL CHARACTERISTIC VALUES OF PLASTICS 29
2.2.2 THERMAL CHARACTERISTIC VALUES 33
2.2.2.1 SHORT-TERM EXPOSURE TO TEMPERATURE 33
2.2.2.2 LONG-TERM EXPOSURE TO TEMPERATURE 35
2.2.2.3 RELEVANT THERMAL CHARACTERISTIC VALUES FOR MID 35
2.2.3 ELECTRICAL CHARACTERISTIC VALUES 37
HTTP://D-NB.INFO/1050306910
2.3 MATERIALS FOR MID TECHNOLOGY 39
2.3.1 THERMOPLASTICS FOR MID 39
2.3.1.1 STANDARD THERMOPLASTICS 40
2.3.1.2 ENGINEERING THERMOPLASTICS 41
2.3.1.3 HIGH-PERFORMANCE THERMOPLASTICS 43
2.3.2 MODIFIED THERMOPLASTICS FOR MID 45
2.3.2.1 RADIATION CROSSLINKED THERMOPLASTICS 46
2.3.2.2 HIGHLY FILLED THERMOPLASTICS 49
2.3.2.3 THERMOPLASTICS FOR SELECTED TECHNOLOGIES OF MID
METALLIZATION 53
2.3.3 THERMOSET PLASTICS FOR MID 58
3 STRUCTURING AND METALLIZATION 63
3.1 STRUCTURING PROCESSES 63
3.1.1 ONE-SHOT INJECTION MOLDING 64
3.1.1.1 LASER STRUCTURING 64
3.1.1.1.1 LPKF-LDS PROCESS 65
3.1.1.1.2 ADDIMID TECHNOLOGY 70
3.1.1.1.3 ALTERNATIVE LASER STRUCTURING PROCESSES 71
3.1.1.2 PRINTING TECHNIQUES 74
3.1.1.2.1 AEROSOL-JET PRINTING 74
3.1.1.2.2 INKJET PRINTING 77
3.1.1.2.3 HOT EMBOSSING 80
3.1.2 TWO-SHOT MOLDING 84
3.1.3 INSERT MOLDING 85
3.1.3.1 FILM INSERT MOLDING 85
3.1.3.1.1 THERMOPLASTIC FOAM MOLDING 86
3.1.3.1.2 INJECTION COMPRESSION MOLDING 86
3.1.3.1.3 PRESS INSERT MOLDING 87
3.1.3.1.4 OTHER VARIETIES OF FILM INSERT MOLDING 88
3.1.4 ALTERNATIVE STRUCTURING PROCESSES 89
3.1.4.1 PRIMER TECHNOLOGY 89
3.1.4.2 TAMPON PRINTING 91
3.1.4.3 PLASMA TECHNOLOGIES 91
3.1.4.3.1 FLAMECON 91
3.1.4.3.2 PLASMADUST 92
3.2 METALLIZATION 96
3.2.1 CLEANING THE SUBSTRATE SURFACE 96
3.2.2 METALLIZATION 97
3.2.3 THICKNESS AND ROUGHNESS OF COATINGS 102
3.2.4 CURRENT-CARRYING CAPABILITY 106
4 ASSEMBLY TECHNOLOGY FOR 3D-MID 113
4.1 PROCESS CHAIN 113
4.2 ASSEMBLY-RELATED CHALLENGES 114
4.2.1 EFFECT OF STRUCTURE 114
4.2.2 COMPONENT PLACEMENT ON THREE-DIMENSIONAL BODIES 115
4.3 AUTOMATED ASSEMBLY 118
4.3.1 REQUIREMENTS 118
4.3.2 APPLICATION OF CONNECTION MEDIUM 118
4.3.3 PLACEMENT OF COMPONENTS 123
4.3.4 REFLOW SOLDERING 134
4.3.5 OPTICAL INSPECTION 135
5 INTERCONNECTION TECHNOLOGY 139
5.1 SPECIFICS AND CHALLENGES 139
5.2 CONNECTION MEDIUMS 143
5.2.1 SOLDER PASTE 143
5.2.2 CONDUCTIVE AND NONCONDUCTIVE ADHESIVES 145
5.2.2.1 ISOTROPIC CONDUCTIVE ADHESIVES 145
5.2.2.2 ANISOTROPIC CONDUCTIVE ADHESIVES 147
5.2.2.3 NONCONDUCTIVE ADHESIVES 147
5.2.3 PRESS-IN PINS 147
5.3 CONNECTION PROCESS 149
5.3.1 REFLOW SOLDERING TECHNIQUES 151
5.3.1.1 INFRARED SOLDERING 151
5.3.1.2 CONVECTION SOLDERING 151
5.3.1.3 VAPOR-PHASE SOLDERING 152
5.3.2 SELECTIVE SOLDERING PROCESSES 155
5.3.3 GLUING 157
5.3.4 PRESS-IN CONNECTION TECHNIQUE 159
5.3.5 CHIP PLACEMENT 162
5.3.5.1 WIRE BONDING 164
5.3.5.2 FLIP-CHIP TECHNOLOGY 166
5.3.5.3 GLOB TOP 168
5.4 INTERFACING TO PERIPHERY 169
5.5 PROTECTING CONNECTIONS AGAINST ENVIRONMENTAL INFLUENCES 170
6 QUALITY AND RELIABILITY 173
6.1 CHALLENGES OF QUALITY ASSURANCE 173
6.2 SIMULATION-ASSISTED QUALITY VALIDATION 175
6.3 NONDESTRUCTIVE TESTING METHODS 176
6.3.1 OPTICAL TESTING AND INSPECTION METHODS 177
6.3.2 AUTOMATED OPTICAL INSPECTION 178
6.3.3 X-RAY ANALYSIS 179
6.3.4 COMPUTERIZED TOMOGRAPHY 180
6.3.5 X-RAY FLUORESCENCE ANALYSIS 181
6.4 DESTRUCTIVE TESTING METHODS 182
6.4.1 ADHESIVE STRENGTH 182
6.4.1.1 PEEL TEST 182
6.4.1.2 PULL-OFF TEST 183
6.4.1.3 SHEAR PULL TEST 184
6.4.1.4 CHISEL TEST 184
6.4.1.5 CROSS-CUT TEST (TAPE TEST) 185
6.4.2 MEASUREMENT OF SHEAR FORCE AND PULL TEST 187
6.4.3 ANALYSIS OF PREPARED SECTIONS 188
6.5 ELECTRICAL CHARACTERIZATION 189
6.5.1 RESISTANCE 190
6.5.2 OHMIC HEATING 191
6.5.3 INSULATING PROPERTIES 192
6.6 RELIABILITY ANALYSIS 192
6.6.1 MID-SPECIFIC CHALLENGES 193
6.6.2 ACCELERATED AGING 194
6.6.3 APPLICATION EXAMPLE I: HIGH-TEMPERATURE MID 196
6.6.4 APPLICATION EXAMPLE II: PRESS-IN CONNECTIONS 198
7 MID
PROTOTYPING 201
7.1 CLASSIFICATION OF SAMPLES AND PROTOTYPES 201
7.1.1 VISUALIZATION SAMPLES 202
7.1.2 CONCEPT MODEL 202
7.1.3 FULLY FUNCTIONAL SAMPLE 203
7.1.4 PROTOTYPE 204
7.2 PROCESSES FOR PRODUCING PLASTIC BLANKS 205
7.2.1 STEREOLITHOGRAPHY 205
7.2.2 SELECTIVE LASER SINTERING 206
7.2.3 FUSED DEPOSITION MODELING 207
7.2.4 VACUUM CASTING IN SILICONE MOLDS 208
7.2.5 MILLING THERMOPLASTIC SEMIFINISHED PRODUCTS 209
7.2.6 INJECTION MOLDING 209
7.3 SAMPLES AND PROTOTYPES PRODUCED BY THE LPKF-LDS PROCESS 210
7.3.1 PROTOPAINT LDS PROCESS 210
7.3.2 LDS PROCESS WITH FDM PLASTIC PARTS 212
7.3.3 LDS PROCESS WITH VACUUM CASTINGS 212
7.3.4 LDS PROCESS WITH MILLED SEMIFINISHED PRODUCTS 212
7.3.5 LDS PROCESS WITH MOLDINGS FROM RAPID TOOLING
INJECTION-MOLDING TOOLS 213
7.3.6 LDS PROCESS WITH MOLDINGS FROM STEEL TOOLS
WITH NONHARDENED INSERTS 213
7.4 SAMPLES AND PROTOTYPES PRODUCED BY HOT EMBOSSING 214
7.5 SAMPLES AND PROTOTYPES PRODUCED BY TWO-SHOT MOLDING 214
7.6 AEROSOL-JET PRINTING ON SLA PARTS 214
7.7 OVERVIEW OF THE VARIOUS COMBINATIONS FOR MID PROTOTYPING 215
8 INTEGRATIVE DEVELOPMENT OF MID 217
8.1 SYSTEMATIC APPROACH FOR THE DEVELOPMENT OF MID 218
8.1.1 VDI GUIDELINE 2206:
DESIGN METHODOLOGY FOR MECHATRONIC SYSTEMS 218
8.1.2 THOMAS PEITZ METHODOLOGY FOR PRODUCT OPTIMIZATION
OF MECHANICAL ELECTRONIC MODULES 220
8.1.3 INGO KAISER S SYSTEMATIC APPROACH FOR THE DEVELOPMENT
OF MECHATRONIC SYSTEMS 222
8.2 REQUIREMENTS 225
8.3 PRODUCT CONCEPTUALIZATION 227
8.4 PRODUCTION-PROCESS CONCEPTUALIZATION 229
8.5 ELECTRONICS DESIGN 235
8.6 ELABORATION OF THE PRODUCTION PROCESS 240
8.7 ELABORATION OF ASSEMBLY AND CONNECTION TECHNOLOGY 242
8.8 WORK PLANNING 244
8.9 MID-SPECIFIC INSTRUMENTS OF DEVELOPMENT 246
8.9.1 MID DESIGN CATALOGS 246
8.9.2 PROPERTIES CARDS FOR MID PROCESSES 248
8.9.3 MID GUIDELINES 250
8.9.4 MID FEATURES 252
8.10 COMPUTER ASSISTANCE 254
8.10.1 MID-SPECIFIC REQUIREMENTS FOR DEVELOPMENT TOOLS 255
8.10.2 SOFTWARE TOOLS FOR DESIGN AND LAYOUT 261
8.10.3 SOFTWARE TOOLS FOR SIMULATION 265
8.10.4 CAD/CAM CHAINS 271
9 CASE STUDIES 277
9.1 OLED 278
9.2 FLOW SENSOR 279
9.3 MULTIBAND ANTENNA FOR SMARTPHONES 280
9.4 ACC POSITION SENSOR 282
9.5 PRESSURE SENSOR 283
9.6 MULT1 LED 284
9.7 INSULIN PUMP 286
9.8 PASSIVE UHF RFID TRANSPONDER 287
9.9 LED CAMERA MODULE 288
9.10 3D SWITCHING MODULE 290
9.11 SECURITY CAPS 292
9.12 SOLAR SENSOR 294
9.13 MICROPHONE CARRIER FOR HEARING AID 295
9.14 SEAT-ADJUSTMENT SWITCH 296
9.15 LED LIGHT 298
10 LIST OF ABBREVIATIONS 301
11 LITERATURE 307
12 AUTHORS AND CONTRIBUTORS 325
12.1 EDITOR 325
12.2 AUTHORS 325
12.3 CONSULTING EXPERTS 330
13 ADDRESSES 331
13.1 RESEARCH ASSOCIATION MOLDED INTERCONNECT DEVICES (3-D MID) 331
13.2 MEMBERS OF THE RESEARCH ASSOCIATION MOLDED INTERCONNECT DEVICES
(3-D MID) 331
INDEX 351
|
| any_adam_object | 1 |
| author | Franke, Jörg 1964- |
| author_GND | (DE-588)141144874 |
| author_facet | Franke, Jörg 1964- |
| author_role | aut |
| author_sort | Franke, Jörg 1964- |
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| building | Verbundindex |
| bvnumber | BV041838552 |
| classification_rvk | ZN 4120 |
| classification_tum | ELT 078f CIT 735f ELT 299f |
| ctrlnum | (OCoLC)880339602 (DE-599)BSZ399512284 |
| dewey-full | 621.381531 |
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| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381531 |
| dewey-search | 621.381531 |
| dewey-sort | 3621.381531 |
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| discipline | Chemie / Pharmazie Elektrotechnik / Elektronik / Nachrichtentechnik Werkstoffwissenschaften / Fertigungstechnik |
| format | Book |
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| id | DE-604.BV041838552 |
| illustrated | Illustrated |
| indexdate | 2024-12-20T16:56:11Z |
| institution | BVB |
| isbn | 9781569905517 9781569905524 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-027283269 |
| oclc_num | 880339602 |
| open_access_boolean | |
| owner | DE-210 DE-29T DE-12 DE-83 DE-703 DE-91G DE-BY-TUM |
| owner_facet | DE-210 DE-29T DE-12 DE-83 DE-703 DE-91G DE-BY-TUM |
| physical | XII, 356 S. Ill., graph. Darst. |
| publishDate | 2014 |
| publishDateSearch | 2014 |
| publishDateSort | 2014 |
| publisher | Hanser |
| record_format | marc |
| spellingShingle | Franke, Jörg 1964- Three-dimensional molded interconnect devices (3D-MID) materials, manufacturing, assembly and applications for injection molded circuit carriers Dreidimensionaler spritzgegossener Schaltungsträger (DE-588)4550503-2 gnd |
| subject_GND | (DE-588)4550503-2 |
| title | Three-dimensional molded interconnect devices (3D-MID) materials, manufacturing, assembly and applications for injection molded circuit carriers |
| title_auth | Three-dimensional molded interconnect devices (3D-MID) materials, manufacturing, assembly and applications for injection molded circuit carriers |
| title_exact_search | Three-dimensional molded interconnect devices (3D-MID) materials, manufacturing, assembly and applications for injection molded circuit carriers |
| title_full | Three-dimensional molded interconnect devices (3D-MID) materials, manufacturing, assembly and applications for injection molded circuit carriers Jörg Franke |
| title_fullStr | Three-dimensional molded interconnect devices (3D-MID) materials, manufacturing, assembly and applications for injection molded circuit carriers Jörg Franke |
| title_full_unstemmed | Three-dimensional molded interconnect devices (3D-MID) materials, manufacturing, assembly and applications for injection molded circuit carriers Jörg Franke |
| title_short | Three-dimensional molded interconnect devices (3D-MID) |
| title_sort | three dimensional molded interconnect devices 3d mid materials manufacturing assembly and applications for injection molded circuit carriers |
| title_sub | materials, manufacturing, assembly and applications for injection molded circuit carriers |
| topic | Dreidimensionaler spritzgegossener Schaltungsträger (DE-588)4550503-2 gnd |
| topic_facet | Dreidimensionaler spritzgegossener Schaltungsträger |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=027283269&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT frankejorg threedimensionalmoldedinterconnectdevices3dmidmaterialsmanufacturingassemblyandapplicationsforinjectionmoldedcircuitcarriers |
Table of Contents
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| Call Number: |
0702 ELT 008f 2014 A 6315
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