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Electromigration modeling at circuit layout level:
Saved in:
Bibliographic Details
Main Author: Tan, Cher Ming (Author)
Format: Electronic eBook
Language:English
Published: Singapore[u.a.] Springer 2013
Series:SpringerBriefs in applied sciences and technology
Subjects:
Ingenieurwissenschaften
System safety
Engineering
Links:https://doi.org/10.1007/978-981-4451-21-5
https://doi.org/10.1007/978-981-4451-21-5
https://doi.org/10.1007/978-981-4451-21-5
https://doi.org/10.1007/978-981-4451-21-5
https://doi.org/10.1007/978-981-4451-21-5
https://doi.org/10.1007/978-981-4451-21-5
https://doi.org/10.1007/978-981-4451-21-5
https://doi.org/10.1007/978-981-4451-21-5
https://doi.org/10.1007/978-981-4451-21-5
http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=026131300&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA
http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=026131300&sequence=000003&line_number=0002&func_code=DB_RECORDS&service_type=MEDIA
Physical Description:1 Online-Ressource
ISBN:9789814451215
DOI:10.1007/978-981-4451-21-5
Staff View

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Record in the Search Index

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adam_text ELECTROMIGRATION MODELING AT CIRCUIT LAYOUT LEVEL / TAN, CHER MING : 2013 TABLE OF CONTENTS / INHALTSVERZEICHNIS INTRODUCTION 3D CIRCUIT MODEL CONSTRUCTION AND SIMULATION COMPARISON OF EM PERFORMANCE IN CIRCUIT STRUCTURE AND TEST STRUCTURE INTERCONNECT EM RELIABILITY MODELING AT CIRCUIT LAYOUT LEVEL CONCLUSION DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT. ELECTROMIGRATION MODELING AT CIRCUIT LAYOUT LEVEL / TAN, CHER MING : 2013 ABSTRACT / INHALTSTEXT INTEGRATED CIRCUIT (IC) RELIABILITY IS OF INCREASING CONCERN IN PRESENT-DAY IC TECHNOLOGY WHERE THE INTERCONNECT FAILURES SIGNIFICANTLY INCREASES THE FAILURE RATE FOR ICS WITH DECREASING INTERCONNECT DIMENSION AND INCREASING NUMBER OF INTERCONNECT LEVELS. ELECTROMIGRATION (EM) OF INTERCONNECTS HAS NOW BECOME THE DOMINANT FAILURE MECHANISM THAT DETERMINES THE CIRCUIT RELIABILITY. THIS BRIEF ADDRESSES THE READERS TO THE NECESSITY OF 3D REAL CIRCUIT MODELLING IN ORDER TO EVALUATE THE EM OF INTERCONNECT SYSTEM IN ICS, AND HOW THEY CAN CREATE SUCH MODELS FOR THEIR OWN APPLICATIONS. A 3-DIMENSIONAL (3D) ELECTRO-THERMO-STRUCTURAL MODEL AS OPPOSED TO THE CONVENTIONAL CURRENT DENSITY BASED 2-DIMENSIONAL (2D) MODELS IS PRESENTED AT CIRCUIT-LAYOUT LEVEL. DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT.
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record_format marc
series2 SpringerBriefs in applied sciences and technology
spellingShingle Tan, Cher Ming
Electromigration modeling at circuit layout level
Ingenieurwissenschaften
System safety
Engineering
title Electromigration modeling at circuit layout level
title_auth Electromigration modeling at circuit layout level
title_exact_search Electromigration modeling at circuit layout level
title_full Electromigration modeling at circuit layout level Cher Ming Tan ; Feifei He
title_fullStr Electromigration modeling at circuit layout level Cher Ming Tan ; Feifei He
title_full_unstemmed Electromigration modeling at circuit layout level Cher Ming Tan ; Feifei He
title_short Electromigration modeling at circuit layout level
title_sort electromigration modeling at circuit layout level
topic Ingenieurwissenschaften
System safety
Engineering
topic_facet Ingenieurwissenschaften
System safety
Engineering
url https://doi.org/10.1007/978-981-4451-21-5
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